TSMC is reportedly developing an advanced packaging technology to rival Intel's Embedded Multi-die Interconnect Bridge (EMIB), which the company internally refers to as EMIB-like. According to sources close to The Information, TSMC's Chip-on-Wafer-on-Substrate (CoWoS) packaging might lose some customers to Intel's EMIB. As a result, TSMC has begun developing its EMIB-like technology. This development will reportedly be supported by Taiwan's Kinsus Interconnect Technology, which will assist TSMC

TSMC's 1.4 nm fab for its A14 node is currently under construction, and according to Taiwan's Commercial Times, the project is expected to be completed by April 2027. This is an impressive timeline for TSMC, which began construction of Taichung Phase II in the expansion area of the Central Taiwan Science Park. If everything goes according to plan, this will allow TSMC to scale the A14 node and start trial production late next year, with mass production set to commence

According to Reuters, Intel has shared access to its renowned "Atom" CPUs with a startup called RosaicLabs Inc. This means Intel will be transferring some of its in-house intellectual property to a third party, a rare occurrence in the semiconductor industry. Specifically, the register-transfer level (RTL) code that defines each CPU part, which is later turned into the actual silicon, will be licensed to Rosaic. Intel's Atom CPU line runs on the x86-64 instruction set. Historically

Samsung Electronics today reported financial results for the second quarter ended June 30, 2026.

The Company posted KRW 171.5 trillion in consolidated revenue, another all-time quarterly high, representing a quarter-on-quarter (QoQ) increase of 28%. Operating profit also reached another all-time high, increasing to KRW 89.5 trillion. Earnings per share for both common and preferred shares increased by 52% to KRW 10,849, among

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centers, cloud infrastructure and accelerated

Innodisk, a leading global AI solution provider, introduces the DDR5 12800 MT/s MRDIMM to support the rapid growth of generative AI, large language models (LLMs), and robotics applications. With an industry-leading data rate of 12800 MT/s, this advanced memory module delivers exceptional bandwidth efficiency and scalability to meet the growing processing demands of AI-driven innovations.

Breaking the Memory Wall with Advanced Architecture
The growing complexity of AI and HPC workloads has exposed the limitations

TrendForce's latest research on the memory industry reveals that AI will remain the primary driver of memory demand in 2027. However, market dynamics are expected to diverge between DRAM and NAND Flash.

On the DRAM side, continued HBM capacity allocation, robust AI server demand, and growing procurement of CPU memory and HBM are expected to keep supply constrained and prices on an upward trajectory. By contrast, NAND Flash is projected to enter a looser supply environment in 2H27 as new production capacity comes online

ASUS today announced two new additions to the ProArt OLED monitor lineup: ProArt Display OLED PA279CDV and PA329CDV. The 26.5-inch ProArt Display OLED PA279CDV and 31.5-inch PA329CDV boast 4K QD-OLED panels with up to 1000 nits peak brightness (3% area) for exceptional contrast. Both monitors offer 99% DCI-P3 and true 10-bit color depth for

Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion," the "Company," "we" or similar terms) today announced its financial results for the quarter ended June 30, 2026. For the second quarter of 2026, net sales (GAAP) increased sequentially to $451.0 million from $342.1 million in the first quarter of 2026. Net income (GAAP) also increased sequentially to $13