Apple Silicon|Intel

Intel Takes Big Strides in Chip Packaging Tech

Intel's silicon fabrication technological edge over TSMC and Samsung may have buckled, but the company appears to have made big advances in chip packaging. We've known for some time about EMIB (embedded multi-die interconnect bridge), Intel's cost-effective alternative to using full-fledged interposers; and Foveros heterogenous multi-die packaging; but the company has apparently invented more forms of 3-D chip stacking, as detailed by a WikiChip Fuse report. By leveraging ODI (omni-directional interconnect)None
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(PR) SteelSeries Launches Apple Exclusive Nimbus+ Wireless Gamepad Controller

SteelSeries, the worldwide leader in gaming and esports peripherals, today announces the Nimbus+ Wireless Gamepad Controller for Apple devices. The Nimbus+ builds on the wildly popular original Nimbus controller, adding a bevy of new features, including clickable joysticks, new Hall effect triggers, and a new 50-hour battery. Purchase of Nimbus+ also includes the new Nimbus+ iPhone Mount which allows users to attach their iPhone directly onto the controller, allowing them to play games more comfortably.

Designed specifically for gaming on Apple devices,None
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Intel

(PR) MSI Announces New PRO 24X 10M & PRO 16T 10M All-In-One PCs

Without question, MSI is not only the market leader in the gaming hardware industry but also the innovative pioneer of technology. MSI always showcases cutting edge technology that surprises the world. As the world tends to be unpredictable, MSI keeps on developing products with stylish, stable, and the best performance for all kinds of users. The MSI PRO series All-in-One PCs are made for both commercial and professional use. It is built to deliver powerful performance, crafted with reliable materials, and optimized for countless applications.None
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(PR) MSI Announces Edge PC MS-9A77 and MS-9A97 Industrial PCs

MSI IPC launches the IoT edge computers, MS-9A77 & MS-9A97 positioned in high-performance products with high efficiency and low energy consumption. This ultra-compact and fanless embedded computer with 3 sides I/O interface, slim type, anti-vibration and shockproof designed to compliance IEC 61373. The DIN-rail mounting form factor is suitable to be used in control cabinet for industrial automation application.

Moreover, it also supports MSI IPC's exclusive HIDACNone
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Apple Silicon|Intel

(PR) GIGABYTE Announces W480 VISION Series Motherboards

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today announced the new W480 VISION series creator and workstation motherboard, to complete the GIGABYTE VISION product line. These new motherboards are designed specifically for the new Intel Xeon W and 10th Gen Core processors which come with up to 12 phase digital power and the latest thermal design, features four sets of memory slots supporting dual-channel ECC and non-ECC Unbuffered DDR4 memory, Intel 2.5GbE + 1None

GIGABYTE Announces HPC Systems Powered by NVIDIA A100 Tensor Core GPUs

GIGABYTE, a supplier of high-performance computing (HPC) systems, today disclosed four NVIDIA HGX A100 platforms under development. These platforms will be available with NVIDIA A100 Tensor Core GPUs. NVIDIA A100 is the first elastic, multi-instance GPU that unifies training, inference, HPC, and analytics. These four products include G262 series servers that can hold four NVIDIA A100 GPUs and G492 series that can provide eight A10None

(PR) EK Expands on Quantum Kinetic TBE Series Products With DDC-Powered Variants

EK, the premium liquid cooling gear manufacturer from Slovenia, EU, is adding more options to its Quantum Line Kinetic TBE products with DDC pump-based combo units. These new DDC-powered combos offer very high head pressure and good flow rates in a small footprint. This makes them very convenient for smaller cases that house powerful hardware with multiple water blocks. EK-Quantum products come with sophisticated addressable D-RGB 5 V LEDs that can be controlled through your motherboard's RGB control software or EK-Loop ConnectNone
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Apple Silicon|Intel

GIGABYTE B550 AORUS Master Waltzes Around Chipset Limitations to Provide Three Gen 4 M.2 Slots

GIGABYTE B550 AORUS Master is the company's most premium socket AM4 motherboard based on the upcoming AMD B550 chipset. We described this board in some detail in our older article covering an assortment of top B550 motherboards from manufacturers, but missed a key detail. At the time we assumed that the PCI-Express lane switches located below the board's main PCI-Express slot merely splits its x16 connection from the AM4 SoC down to two x8 connectionsNone
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Intel

Intel "Tiger Lake-U" Processor with Relatively High Clock Speed Spotted

An unnamed Intel "Tiger Lake-U" quad-core processor was spotted on Futuremark database by _rogame, featuring 2.80 GHz nominal clock-speeds. Barring the 28 W i7-1068NG7 and i5-1038NG7, which are exclusive for MacBooks and aren't considered U-segment, all current-gen "Ice Lake" client chips have their nominal clock speeds ranging between 1.00 to 1.30 GHz.None

Intel

AMD Ryzen 7 4700G "Renoir" Desktop Processor Pictured

Here is the first picture of the AMD Ryzen 7 4700G, the company's upcoming socket AM4 APU based on the 7 nm "Renoir" silicon, courtesy of VideoCardz. The picture reveals a standard-looking socket AM4 chip with commercial name and OPN markings (100-000000146), matching the Igor's Lab OPN code leak from earlier this week. The Ryzen 7 4700G offers an 8-core/None