Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years.
Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands.
TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased

