The proliferation of AI has certainly caused a long-term crisis in the computing landscape, but if there’s one positive to gain from all of this, it’s that companies are aggressively pushing towards designing chips of superior capabilities to tackle the competition at a fiercer pace. Unsurprisingly, one of those companies is Apple, which reportedly taped out the M7 just six months after the same process was completed for the M6. This would explain why the M6 Pro and M6 Max won’t arrive

Building a gaming PC in 2026 has become considerably more expensive than it was only a year or so ago, and graphics cards are not solely responsible this time. The ongoing memory shortage has driven up the cost of all DRAM and NAND flash-based products, such as memory kits, SSDs, and graphics cards.

For that reason, we consider approximately $1,000 to be the realistic starting point for a decent new gaming PC in July 2026 . Even then, some

Apple has tossed its heretofore predictable M-series chip launch cadence in the air, adding a hefty dose of unpredictability into the proverbial mix. Now, however, the legendary tipster Mark Gurman is out with yet another scoop, disclosing an early 2027 launch window for the M6 iPad Pro and a re-designed Apple Pencil.

We reported recently that Apple has significantly revamped its silicon-related plans , settling on the launch of the M5 Ultra and the base M6 later this year, and then

Apple is planning to skip the M6 Ultra launch, instead choosing to launch the M5 Ultra later this year, followed by the M7 Ultra after it unveils the M7 Pro and M7 Max sometime in 2027 . Fortunately, the new workstation-class silicon will be worth the wait, especially for those who aspire to run multi-billion-parameter AI models on their systems but are limited by memory constraints. This is because a new report states that the M7 Ultra will feature double

In 2026, we live in the worst kind of memory crisis that the consumer market has ever faced. Some people call it the RAMmageddon, and others call it the RAMpocalypse. Whichever way you want to call it, one thing is set: shortages created by massive demand in the AI and data center segment have led to a severe hike in prices across all memory segments.

This came at a time when memory speeds were seeing rapid updates. We saw speeds surge past 9000 MT

In 2026, we live in the worst kind of memory crisis that the consumer market has ever faced. Some people call it the RAMmageddon, and others call it the RAMpocalypse. Whichever way you want to call it, one thing is set: shortages created by massive demand in the AI and data center segment have led to a severe hike in prices across all memory segments.

This came at a time when memory speeds were seeing rapid updates. We saw speeds surge past 9000 MT

In the AI race, Apple isn’t the first name that you’d expect to be ahead of its rivals, but when it comes to chipsets that are tailor-made to tackle the aforementioned workloads, we doubt other names come to mind. While we have reported that the M7 is being designed to bring even better on-device AI performance to the table, the M8 is expected to surpass its predecessor in this aspect, while also being one of the company’s first silicon range to leverage

AMD's latest Radeon drivers silently added Multi-Frame Generation (MFG 8x) modes along with other FSR overrides, as exposed in RadeonTuner .

AMD has been teasing FSR Multi-Frame Generation (MFG) support for its Radeon GPU in the latest drivers for a while. The last FSR Redstone update saw preliminary support added to the ADLX FidelityFX SDK . Although MFG is not available across any Radeon GPU yet, the listed feature will allow users to select a desired frame generation ratio for "optimal performance & visual quality

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand.

AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen.

Leading this advanced packaging race is none other than TSMC, whose CoWoS (Chip-on-Wafer-on-Substrate) had a