Raphaël Colantonio Quit Arkane in 2017, Yet Now Dangles a Buyout Offer as Xbox Scrambles to Offload the Dishonored Maker

The rumors regarding Xbox 's studio divestitures were spot on: Compulsion Games and Double Fine are returning to management, Ninja Theory and Undead Labs are being sold, and Arkane Lyon is still evaluating its strategic options with the Work Council.

While the four aforementioned teams already know their fate, the same cannot be said for the French team behind Dishonored and Deathloop , which may be embroiled in months of negotiations and work to find a solution. However, Arkane founder Raphaël Colantonio appears to have expressed interest in acquiring the

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Intel Nova Lake CPUs To Bring Back AVX-512 Support Six Years After The Chipmaker Abandoned It On Client Platforms

Intel Nova Lake CPUs will mark the return of AVX-512, a feature that has long been abandoned by the company for its client CPUs.

Intel has had a love-hate relationship with AVX-512 on its consumer CPUs. The AVX-512 instruction set was last seen on Intel's Tiger Lake (11th Gen) family , and since then, the company has offered no support for it on its modern-day chips. Meanwhile, AMD has been offering AVX

Text describing the implementation of xor_gen() using AVX-512, enabled on AMD Zen 4, Intel Sapphire Rapids, Rocket Lake, and Nova Lake CPUs with AVX512F.
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Xbox Layoffs Have Reportedly Gutted id Software, Obsidian, and ZeniMax Online, and Elder Scrolls Online’s Roadmap Will Have to Change

Under the guise of the great Xbox reset, Asha Sharma 's big scissors have cut heavily among the internal studios . While none of the studios that were in danger of being closed will actually be shut down, which is indeed amazing news, some of the most successful teams remaining inside Xbox and Bethesda have been severely affected by layoffs , according to reports.

Obsidian Entertainment , for instance. The Californian studio has been one of the most productive since it joined Xbox in 2018, releasing The Outer Worlds 1

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Intel’s XBM Memory Takes Aim At HBM4, Promising 32 GT/s Speeds And Lower Costs Through UCIe Links

Intel has published a new patent on its XBM memory, which is proposed as a replacement for HBM4 , offering much higher bandwidth capabilities.

HBM continues to be the standard for AI accelerators, but more recently, we have seen LPDDR memory being used to overcome shortages, prices, and power associated with the standard.

Intel's past attempts at DRAM, such as HMC (Hybrid Memory Cube) and MCDRAM , faced various issues and never came to market, but with XBM, Intel is course-correcting its DRAM

A diagram labeled 'FIG. 1B' from a patent application shows a stacked semiconductor structure comprising multiple layers marked with dimensions such as '~4.5 MM,' '~10 MM,' and '~30 μM.'
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NVIDIA Quashes Rubin & Kyber Rack Delay Rumors, Says “Chip Roadmap Is Intact”

NVIDIA has denied reports of a delay regarding its upcoming Rubin & Kyber products, stating that its chip roadmap remains intact.

NVIDIA Rubin Remains on Track For Kyber Racks As It Denies Any Change In Its Roadmap

Recently, there have been many rumors regarding a delay in NVIDIA's upcoming products, such as Rubin, Rubin Ultra, and the respective Kyber racks.

A presentation slide titled 'NVIDIA Extreme Co-Design Delivering X-Factors Every Year' showcases a series of hardware architectures labeled as Blackwell, Rubin, and Feynman, featuring various NVLink models and CPUs for the years 2024, 2026, and 2028.
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Samsung Posts A Shocking Miss On Revenue For Q2 2026 At A Time When Investors Were Positioned For A Pristine Print

With a Samsung executive already having stunned the world at large by declaring that the South Korean tech giant's profits in 2026 would eclipse the cumulative profits it earned over the past 40 years, it was largely a fait accompli that Samsung's provisional results for the second quarter of 2026 would be shockingly good. And, as the fates would have it, Samsung has just disappointed the market by a long shot on its revenue metric.

Samsung has now released key guidance for its Q


Anthropic Now Thinks Claude Has A Soul, As Evidence Emerges Of “Convergent Evolution” Between AI And The Human Brain

If you are a millennial, chances are that you must have watched the 2004 sci-fi film I, Robot, where an NS-5 humanoid robot and the V.I.K.I supercomputer develop consciousness. Well, Anthropic now thinks something comparable, but far less dramatic, is taking place within its Claude AI model.


iPhone 18 Pro Logic Board’s High-Resolution Images Show A20 Pro Occupying Larger Die Area With Next-Generation Packaging & Qualcomm 5G Modem

We’ve already had our first gander at the logic board belonging to the iPhone 18 Pro and iPhone 18 Pro Max , with the most notable difference coming from the A20 Pro and its unique Wafer-Level Multi-Chip Module Packaging (WMCM) that has moved the DRAM to the side to improve heat dissipation. While the previous leak didn’t deliver on image quality, we now have high-resolution shots of what the upcoming logic board will look like, along with getting a closer look

Check out these high-resolution iPhone 18 Pro logic board pictures showing the A20 Pro
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Sony’s Disc-Free 2028 Plan Hands it Total Price Control, Dutch Group Warns in Exclusive Wccftech Statement as €400M Lawsuit Escalates

Last week, Sony dropped an explosive news on PlayStation gamers: no more PlayStation discs will be produced from January 2028 , thus essentially confining even the retail market to a digital-only future (physical copies will include a download code, just like GTA VI ).

This inevitably triggered a massive backlash on the Internet, with fans whipping up petitions to get Sony to change their mind and legendary game designer Hideo Kojima sharing his sadness at the news. But that's not the only kind of reaction Sony

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Hybrid Bonding Was HBM4’s Headline Upgrade, Yet Samsung and SK hynix May Sideline it Over Relaxed JEDEC rules

With hybrid bonding making the news for becoming the preferred choice of bonding for next-generation memory chips, a relaxation of standards by the Joint Electron Device Engineering Council (JEDEC) could lead to Samsung and SK hynix skipping the technology for HBM4 memory, suggests a report from the Korean press. The previous standards had determined that next-generation HBM memory would have a thickness of 900 micrometers, but the new standards could mean that the thickness is relaxed to 1,000 micrometers.

Word about SK