Alongside Intel’s sizable announcement today regarding their manufacturing roadmap over the next half-decade , the company is also announcing their first major customer for their third-party foundry service, IFS. And in an example of how Intel’s entry into the contract fab business is going to make for some strange bedfellows, it turns out that major customer is Qualcomm.

Per Intel’s announcement, Intel and Qualcomm are partnering up to get Qualcomm products on Intel’s 20A process, one of the company’

In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated that Intel would be returning to product leadership in 2025, but hasn’t yet explained how this is coming about – that is until today, where Intel has disclosed its roadmap for its next five generations of process node technology leading to 2025. Intel believes it can follow an aggressive strategy to match and

Kicking off another earnings season for the tech industry, we as always start things off with Intel, who is the first big chipmaker out of the gate. Over a year into the coronavirus pandemic – and slowly heading out of it – Intel has seen its ups and downs as product demands have shifted and the company’s ability to execute over the long term has been challenged by fab delays. Following a particularly painful (by Intel standards) first quarter, the company is hoping to put those problems behind them with a

Today OnePlus is announcing the 2021 successor to the OnePlus Nord – the company mid-range line-up phone. The new phone takes the hardware platform from the OPPO Reno 5 Pro in that it is now powered by the new MediaTek Dimensity 1200.

The design of most leading edge processors and ASICs rely on steps of optimization, with the three key optimization points being Performance, Power, and Area (and sometimes Cost). Once the architecture of a chip is planned, it comes down to designing the silicon of that chip for a given process node technology, however there are many different ways to lay the design out. Normally this can take a team of engineers several months, even with algorithmic tools and simulation to get a good result, however that role is gradually

With the launch of Intel’s Ice Lake Xeon Scalable platform comes a new socket and a range of features that vendors like Supermicro have to design for. The server and enterprise market is so vast that every design can come in a range of configurations and settings, however one of the key elements is managing compute density with memory and accelerator support. The SYS-120U-TNR we are testing today is a dense system with lots of trimmings all within a 1U, to which Supermicro is aiming at

Known for its core design IP that ends up in everything from IoT to smartphones to servers, Arm is now presenting that it has enabled one of its key microcontrollers in a new form factor: rather than using silicon as a base, the company has enabled a processor core in plastic. The technology has been in the works for almost a decade, but Arm has been waiting on the fabrication methods to create a fully working core. Now the company has something working in a tangible medium and the research has been published in

Today, we are taking a look at SilverStone's latest family of AIO coolers, the IceGem series. Designed explicitly with Ryzen Threadripper compatibility in mind, the IceGem coolers are meant to fill the hole in SilverStone's AIO cooler lineup, offering a single family of coolers that can be used with any desktop socket, large or small.

Today we’re finally taking a deeper look at Xiaomi’s Mi 11 Ultra – the bigger brother of the Mi 11. Featuring the same screen and general design, can the big camera setup warrant double the price over the Mi 11?