Computex 2021: ASRock Announces Mars 5000U Series Mini PC

During Computex 2021, ASRock unveiled the latest series in its Mars mini-PC range, the Mars 5000U. ASRock claims it's the thinnest AMD mini PC globally and comes equipped with AMD's latest 5000 series APU. It features support for DDR4-3200 SO-DIMM memory, one PCIe 3.0 x4 M.2 slot, a 2.5" SATA hard drive bay, and an Intel Wi-Fi 6 interface

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Computex 2021: GIGABYTE Server Updates MZ72-HB0 For Dual Socket 3rd Gen EPYC

During Computex 2021 in Taipei, although the event is all-digital due to the Coronavirus pandemic, GIGABYTE Server has showcased its newly revised MZ72-HBO dual-socket motherboard with support for AMD's 3rd generation EPYC 7003 processors. The GIGABYTE Server MZ72-HBO boasts support for up to 128 cores and 256 threads (64c/128t per socket), dual 10 GbE Base-T Ethernet, up to

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Computex 2021: ASRock Unveils New X570S and B550 PG Riptide Motherboards

Back in July 2019, when AMD unveiled its X570 chipset for its Ryzen processors, it captivated enthusiasts and PC users as the first desktop chipset to feature PCIe 4.0. This brought many vendors wondering how to keep the chipset cool, and all but one (GIGABYTE X570 Aorus Xtreme) came with some form of active cooling. Fast forward to 2021 and the latest iteration of new models dubbed X570S does away with the chipset fan altogether

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Computex 2021: MSI MPG Gaming Maverik Bundle with i7-11700K

At an all-digital rendition of Computex 2021, MSI has unveiled a new bundle designed for gamers looking for a comprehensive and optimized gaming system. Based on its performance gaming series, the MSI MPG Gaming Maverick bundle comes complete with an Intel Core i7 11th generation Rocket Lake processor and special edition components, including G.Skill Trident Z Maverik DDR4 memory, an MSI MPG Z590 Gaming Edge WIFI SP motherboard, and an SP edition Coreliquid 360 mm AIO. All

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NVMe 2.0 Specification Released: Major Reorganization

Version 2.0 of the NVM Express specification has been released, keeping up the roughly two year cadence for the storage interface that is now a decade old. Like other NVMe spec updates, version 2.0 comes with a variety of new features and functionality for drives to implement (usually as optional features). But the most significant change—and the reason this is called version 2.0 instead of 1.5—is that the spec has been drastically reorganized to better fit the broad scope of features that

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ASRock Announces AMD X300TM-ITX Motherboard: Thin ITX For Ryzen APUs

Once upon a time, the term 'bigger is better' was a marketing slogan that many companies adopted for its products, but sometimes 'bigger' isn't necessarily practical. For use cases where size (smaller) actually matters, ASRock has unveiled a dinky little motherboard designed for use with its Ryzen based APUs, the X300TM-ITX. Based on AMD's AM4 chipset and the Thin Mini-ITX form factor, it includes one M.2 slot, dual HDMI video output

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HP Completes HyperX Acquisition For $425 Million

Back in February, we revealed that HP was set to acquire the HyperX brand , the gaming subsidiary of Kingston Technology. HyperX has been the gaming branding for Kingston Technology over the years, with memory, flash, SSDs and peripherals all marketed under the HyperX banner. Like many companies with its own gaming-focused brand, Kingston has kept the brand as a disaggregated entity in strategy and marketing. Today, the acquisition by HP of the HyperX brand has been completed for a fee of $425 million, with

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Intel

Micron Announces PCIe 4.0 Client SSDs

In Micron's keynote today at (virtual) Computex, the memory manufacturer announced they have started shipping the companies first PCIe 4.0 SSDs, using their latest 176-layer 3D TLC NAND flash memory. The two new product families are the Micron 3400 and 2450 series client SSDs.

The 3400 series is their high-end client SSD, with double the read throughput of their preceding Micron 2300, and 85% higher write throughput

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TSMC Manufacturing Update: N6 to Match N7 Output by EOY, N5 Ramping Faster, Better Yields Than N7

As part of a regular TSMC Technology Symposium, the foundry published updates on its status on it’s current leading-edge manufacturing technologies, the N7, N5 and their respective derivatives such as N6 and N5.

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Intel

AMD confirms Ray-Tracing and VRS in Samsung Exynos RDNA GPU IP

At this year’s AMD Computex 2021 keynote event, CEO Lisa Su, among a series of various new product announcements and technology disclosures , has teased some new details on the company’s cooperation with Samsung in regards to the new RDNA GPU IP that’s been licensed out and the two companies have been working on to deliver in the next-generation Exynos SoCs.