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NVIDIA Unveils Grace: A High-Performance Arm Server CPU For Use In Big AI Systems
Kicking off another busy Spring GPU Technology Conference for NVIDIA, this morning the graphics and accelerator designer is announcing that they are going to once again design their own Arm-based CPU. Dubbed Grace – after Grace Hopper, the computer programming pioneer and US Navy rear admiral – the CPU is NVIDIA’s latest stab at more fully vertically integrating their hardware stack by being able to offer a high-performance CPU alongside their regular GPU wares. According to NVIDIA, the chip is being designed specifically for large-scale neural network
The NVIDIA GTC 2021 Keynote Live Blog (Starts at 8:30am PT/15:30 UTC)
Join us at 8:30am PT for our coverage of NVIDIA’s annual GPU Technology Conference keynote address . The traditional kick-off to the show – be it physical or virtual – NVIDIA’s annual spring keynote is showcase for NVIDIA’s vision for the next 12 to 24 months across all of their segments, from graphics to AI to automotive. Along with slew of product announcements, the presentation, delivered by CEO (and lovely kitchen owner) Jensen Huang always contains a few surprises.
Sabrent Rocket Q4 and Corsair MP600 CORE NVMe SSDs Reviewed: PCIe 4.0 with QLC
A PCIe Gen4 SSD controller can get more performance out of QLC NAND, but can a QLC SSD ever be more than a low-end drive?
Silicon Motion Announces SM2708 SD Express Controller
Silicon Motion has announced their first SD Card controller to support the NVMe-based SD Express interface. The new SM2708 controller is capable of sequential transfer speeds of 1700 MB/s, vastly higher than the 104 MB/s most SD devices and cards are limited to using the older but widely-supported UHS-I interface.
In 2018, version 7.0 of the SD specification introduced the PCIe and NVMe-based SD Express interface as the new way
GIGABYTE Server: Three New E-ATX Motherboards For Intel Ice Lake-SP Xeons
Hot on the heels of Intel's latest Ice Lake-SP 3rd Generation Xeon Scalable processor launch, GIGABYTE Server has listed three new motherboards designed for server use. The GIGABYTE Server MU92-TU1, the MU92-TU0, and MU72-SU0 all offer different levels of features and controllers and are based on Intel's C621A chipset for 3rd Gen Xeon Scalable. Two are built on the E-ATX form factor, with one ATX
Intel 3rd Gen Xeon Scalable (Ice Lake SP) Review: Generationally Big, Competitively Small
The launch of Intel’s Ice Lake Xeon Scalable processors has been in the wings for a number of years. The delays to Intel’s 10nm manufacturing process have given a number of setbacks to all of Intel’s proposed 10nm product lines, especially the high performance Xeon family: trying to craft 660 mm2 of silicon on a process is difficult at the best of times. But Intel has 10nm in a place where it is economically viable to start retailing large Xeon processors
G.Skill Announces DDR4-5333 Memory Kits for Intel Rocket Lake
Designed with a focus on Intel's latest 11th generation Rocket Lake processors and the new memory controller ratios, G.Skill has announced a wave of new memory kits designed to squeeze as much performance out of the platform. The new memory kits for Z590 and Rocket Lake feature speeds of up to DDR4-5333. They will be made available across multiple lines of its range, including the premium Trident Z Royal, Trident Z RGB, and the more affordable Ripjaw V series
LG Calls it Quits, To Close Mobile Phone Business
This morning, LG issued a press release that announced the board of directors had decided to close down the conglomerate’s mobile phone business. The news is unfortunate, however isn’t too surprising given the mobile division had been accruing continuous operational losses over the last 6 years , greatly denting the company’s financials.
SEOUL, April 5, 2021 — LG Electronics Inc. (LG) announced that it is closing its mobile business unit. The decision was approved by its board of directors earlier today
SK Hynix to Build $106 Billion Fab Cluster: 800,000 Wafer Starts a Month
Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab complex. The fab cluster will be primarily used to build DRAM for PCs, mobile devices, and servers, using process technologies that rely on extreme ultraviolet lithography (EUV). The first fab in the complex will go online in 2025.
The new cluster will house four huge semiconductor