Hot Chips 2020 Live Blog: Intel's Tiger Lake Mobile CPU (12:30pm PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote. Stay tuned at AnandTech for our live blogs as we commentate on each talk.
Hot Chips 2020 Live Blog: AMD Ryzen 4000 APU (Noon PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote. Stay tuned at AnandTech for our live blogs as we commentate on each talk.
Next up is AMD's Ryzen 4000 Renoir talk.
Hot Chips 2020 Live Blog: IBM z15, a 5.2 GHz Mainframe CPU (11:00am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote. Stay tuned at AnandTech for our live blogs as we commentate on each talk.
Hot Chips 2020 Live Blog: Marvell ThunderX3 (10:30am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote. Stay tuned at AnandTech for our live blogs as we commentate on each talk.
Hot Chips 2020 Live Blog: IBM's POWER10 Processor on Samsung 7nm (10:00am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote. Stay tuned at AnandTech for our live blogs as we commentate on each talk.
Hot Chips 2020 Live Blog: Next Gen Intel Xeon, Ice Lake-SP (9:30am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote. Stay tuned at AnandTech for our live blogs as we commentate on each talk. Each one of the 11 or so talks today will get its own self-contained live blog.
Our first talk of the day is from Intel, about its next-generation Ice Lake Xeon Scalable processor. Come back at 9
Intel Brand Tie-ins: New Avengers Packaging Gives You a New Box To Play With
When buying a new processor, what’s the first thing to look for? Price? Performance? Frames per Second? The Box? Intel’s new brand tie-in with Marvel’s Avengers now seems official, according to the @IntelGraphics twitter handle. With the new special edition processors, users can look forward to a brightly painted box. Yes, that’s pretty much it. Oooh, shiny shiny.
Leaks have suggested that these new boxed processors will carry new versions of Intel’s overclockable
Intel Next-Gen 10-micron Stacking: Going 3D Beyond Foveros
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One of the issues facing next-generation 3D stacking of chips is how to increase the density of the die-to-die interface. More connections means better data throughput, reducing latency and increasing bandwidth between two active areas of silicon that might be manufactured at different process nodes. There’s also a consideration for power and thermal hotspots as well. Intel has been developing its own physical interconnect topologies, most of which we’ve covered in detail before, such as the Embedded Multi-Die Interconnect Bridge (
Intel Alder Lake: Confirmed x86 Hybrid with Golden Cove and Gracemont for 2021
Following leaks is often a game of cat and mouse – what is actually legitimate and what might not be. Traditionally AnandTech shies away from leaks for that very reason, and we prefer to have multiple sources that are saying the same thing, rather than addressing every potential rumor on the blogosphere. Nonetheless, hints towards a new product from Intel, Alder Lake, have been cropping up over the past few months, including getting a small mention in Intel’s Q2 2020 earnings . The leaks have suggested
Micron Spills on GDDR6X: PAM4 Signaling For Higher Rates, Coming to NVIDIA’s RTX 3090
It would seem that Micron this morning has accidentally spilled the beans on the future of graphics card memory technologies – and outed one of NVIDIA’s next-generation RTX video cards in the process. In a technical brief that was posted to their website, dubbed “The Demand for Ultra-Bandwidth Solutions”, Micron detailed their portfolio of high-bandwidth memory technologies and the market needs for them. Included in this brief was information on the previously-unannounced GDDR6X memory technology, as well as some information on