HP ENVY Laptop Refresh Adds OLED And RTX For 2020

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While HP’s Spectre lineup is what HP would probably consider their top-tier brand, the ENVY series has quietly become a very potent competitor, with premium-grade materials, and even discrete graphics, while still coming in sometimes hundreds of dollars less than the Spectre models. For 2020, HP is ramping up the ENVY lineup, refreshing all of the models, but the company has put special focus on the 15.6-inch ENVY 15 for this year.

ENVY 15

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Apple Announces New Updated iPhone SE: A13 & New Features for $399

Apple’s last “classic” iPhone release was the iPhone 8 back in 2017, with the 2016 iPhone SE (Special Edition) being the last iteration donning the iPhone 4 design language. It’s safe to say both these devices had been getting a bit long in the tooth, and there’s still plenty of people out there which loved the 4.7” form-factor – and possibly unwilling to update to the newer bigger models.

Luckily, Apple seemingly agrees that

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XPG Spectrix D50 Memory: A More Subtle RGB DDR4

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ADATA's XPG division has unveiled its latest addition in the high-performance DRAM segment, the Spectrix D50. Starting from 8 GB DDR4-3000 modules, the latest Spectrix D50 kits will go up to 32 GB capacity, with some capacities hitting speeds of up to DDR4-4800.

XPG is the gaming division of ADATA, and has a broad portfolio of DRAM catering to multiple areas on the market. The latest from XPG is the Spectrix D

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Honor Launches Honor 30 Series in China: Three New Premium Devices

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ADATA's New 32 GB DDR4-3200 SO-DIMM, Ideal for Ryzen Mobile

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ADATA, one of the leading manufacturers of DRAM and NAND products, has just unveiled its latest memory modules. The new ADATA DDR4-3200 32 GB parts are available in both UDIMM and SO-DIMM format with an operating voltage of just 1.2 V. This is just the ticket for adopters of the new Ryzen 4000 Mobile platform looking to run high-capacity memory without compromising on throughput performance.

Back at Computex 2019, ADATA showed off its DDR4

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Tyan Updates Transport HX Barebones To Support AMD EPYC 7F32 CPU

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Alongside today's launch of AMD's new EPYC 7F32, 7F52, and 7F72 processors, stalwart server motherboard and chassis vendor Tyan has officially announced their support for the new chips. Complimenting AMD's announcements, Tyan is adding support for the chips to select models of their Transport HX barebones servers, which are designed for high-performance computing and server data-driven workflows.

On the back of a new range of EPYC 7002 processors focused on higher

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OnePlus Announces OnePlus 8 & OnePlus 8 Pro: Step-Up 2020 Flagships

As the world is in quarantine, smartphone companies aren’t standing still and are still moving forward with their new product launches. We’ve seen almost every other company on the market release their 2020 flagships – but one important vendor has been missing from the line-up: OnePlus. Today, the company is finally revealing its newest OnePlus 8 and OnePlus 8 Pro phones, offering improvements and technology advancements at the highest levels.

Particularly the new OnePlus 8 Pro seems to be the company’s most


Intel

AMD’s New EPYC 7F52 Reviewed: The F is for ᴴᴵᴳᴴ Frequency

Everyone wants a fast processor. The ability to get more stuff done is one of a number of guiding principles of business. However, business also needs consistency, safety and security, which is why having enterprise-class processors is often a requirement in the back-end infrastructure. These processors, with lots of cores, aren’t as fast as consumer processors, so it becomes a tussle whether it makes sense to go fast without security, or to play it safe with a proven platform. With AMD’s


Apple Silicon

Apple’s A12Z Processor Confirmed to Reuse A12X Silicon

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Last month Apple introduced its latest generation of iPad Pro tablets , and much to the surprise of many, the new iDevices didn’t come with a high-end variant of Apple’s newest A13 SoC. Instead, the iPads used an SoC that Apple was calling the A12Z, clearly indicating that it was based on the same Vortex/Tempest architecture as the earlier A12X , which was used in the 2018 iPad Pros. The unusual move from Apple left us

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China Develops High Capacity QLC 3D NAND: YMTC at 1.33 Tb

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Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its Xtacking architecture which enables it to run with super high I/O while maximising the density of its memory arrays. YMTC has also unveiled its plan for a 128-layer 512 Gb TLC chip, the X2-9060

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