Microsoft tests microfluidic cooling for next-gen AI chips

Microsoft is working on a new way to cool AI chips, using microfluidics to bring liquid directly inside the silicon. Unlike cold plates, which sit on top of the chip and are blocked by packaging layers, this approach carves tiny channels into the silicon itself. Coolant flows through these grooves and pulls heat away at the source.
In Microsoft’s tests, microfluidics removed heat up to three times more effectively than cold plates. It also cut the maximum GPU temperature rise







