Igor’sLAB has an interesting performance simulation of Radeon RX 6600 non-XT, a graphics card that has not yet been released but has been seen in the leaks.
The AMD Radeon RX 6600 non-XT had already appeared in the leaks numerous times. The most recent rumor was that the SKU is set to launch in September , while PowerColor had even begun listing this model specifically on
In Hot Chips 33 presentation AMD outlines the future of 3D stacking technology, also sharing first details on its 3D V-Cache stacking.
AMD presentation showcases existing and future 3D stacking technologies. As the TSV (Through Silicon Via), a vertical inter-wafer or inter-die connection, sees an increase in bonds, the technology will be focusing on more complex 3D stacking designs. At this point in time, stacking
At HotChips 33 Samsung confirmed it is developing a DDR5 memory module featuring 8-stacks TSV modules, a double of what DDR4 memory was capable of. This means that theoretically, 512GB memory modules are possible in the future.
With optimized packaging, Samsung plans to bring eight-stacked packages with lower heights than DDR4 4-stack memory. A reduction of height was possible thanks to a smaller gap between the dies (
An early test result of the Intel Alder Lake processor has been spotted on the PugetBenchmark website.
Intel Core i9-12900K, the flagship processor of the upcoming 12th Gen Core series codenamed “Alder Lake-S” has just made its first appearance with the full SKU name on the PugetBenchmark website. The result does not only mention the SKU
The upcoming 600 series motherboards will span across a very wide spectrum of platforms, including high-end desktops all the way down to mainstream series, a new leak directly from Intel appears to suggest.
Intel Chipset driver “10.1.18836.8283” lists a full range of 600-series motherboards. This includes the Z690 high
Please note that this post is tagged as a rumor .
Greymon55 has new information on the RDNA4 series.
The leaker from Twitter, who had previously shared confidential information before (with many things still to be confirmed) now claims that the RDNA4 series, a successor to RDNA3, which is set to launch next year, will feature more GPUs and will use a smaller node process. AMD RDNA4 series is to continue using
Project Dojo puts Tesla back into a race for high-performance solutions for artificial intelligence training.
At Tesla AI Day, the company announced its new D1 Chip, custom processors based on 7nm process technology with 50 billion transistors. This chip has a die area of 645 mm², smaller than both NVIDIA A100 (826 mm²) and AMD Arcturus (750mm²). Specifications-wise, the chip
Memory overheating may not always be due to poor-quality thermal pads.
Just two weeks we reported on PowerColor accidentally shipping a graphics card with thermal pad covers still on, only to report on another surprising mistake by a manufacturer. This time around it’s from NVIDIA themselves, or to be precise the company that puts their Founders Edition graphics card together.
One of the factory workers has left a finger cot that is used to protect the graphics
TechPowerUP has a picture of the AMD AM5 socket platform which confirms PCIe Gen4 support.
Yesterday Intel confirmed its upcoming 12th Gen Core Series codenamed “Alder Lake” will be the first to support PCIe Gen5. Meanwhile, AMD’s Raphael Ryzen CPU Series which are now expected in 2022, will not support this standard, a leaked diagram confirms. The origin of this diagram is likely from the
Please note that this post is tagged as a rumor .
Moore’s Law is Dead has a video covering a wide spectrum of Intel’s future consumer and data center products.
According to the YouTuber, who has a very good track record on Intel leaks, the manufacturer has ambitious plans for its future. While we still await Intel’s 12th Gen Core “Alder Lake” series to launch later this year,
