Hot Chips 33: 3D packaging, chiplets, Intel Alder Lake, and Sapphire Rapids
As a reminder, Intel will be disclosing the first details on its mainstream heterogeneous architecture at Hotchips 33.

On August 22nd, a 3-day technological symposium called Hot Chips 33 will begin. Due to uncertainty around the spread of Covid-19, it was decided that the symposium will not be an in-person conference. All content will be broadcasted through a live stream to registered attendees. The






