Intel

Nvidia outlines plans for using light for communication between AI GPUs by 2026 — silicon photonics and co-packaged optics may become mandatory for next-gen AI data centers

(Image credit: Nvidia)

The extreme demands of passing communication between ever-growing clusters of AI GPUs is fueling a move towards using light for communication across the networking layers. Earlier this year, Nvidia outlined that its next-generation rack-scale AI platforms will use silicon photonics interconnects with co-packaged optics (CPO) for higher transfer rates at lower power. At the Hot Chips conference this year, Nvidia released some additional information about its next-generation Quantum-X and Spectrum-X photonics interconnection solutions and

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AMD's unreleased Ryzen 5 5500X3D is reportedly 12% faster in multi-core performance in Geekbench — budget Zen 3 chip spotted running in Linux

(Image credit: AMD)

AMD launched the Ryzen 5 5500X3D a few months ago, but it hasn’t received much attention due to its exclusivity to the Latin American market. Positioned as a budget-friendly chip, it builds upon the standard Ryzen 5 5500 with the addition of 3D V-Cache, giving it a notable boost in gaming performance. However, it’s not just fast in that area, as new benchmarks suggest that the 550

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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques

(Image credit: Micron)

Imagine trying to build a tower out of hundreds of very thin, slightly different sheets of material, where each sheet wants to bend or warp on its own. That’s essentially what researchers at imec and Ghent University accomplished when they grew 120 alternating layers of silicon (Si) and silicon-germanium (SiGe) on a 300 mm wafer—a key step toward three-dimensional DRAM. At first glance, it sounds like stacking sheets of paper, but in

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Microsoft's Windows 95 release was 30 years ago today, the first time software was a pop culture smash

(Image credit: Future)

Microsoft ’s momentous Windows 95 operating system became available to the public on this day 30 years ago. Computing enthusiasts were queuing around the block at midnight launch events. Perhaps this was the first time an OS launch became a cultural event – one that was carefully primed by the launch a month earlier, and the Start Me Up advertising campaign.

Windows 95 - Start Me Up - Promo / Commercial (High Quality 720p) - YouTube
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‘Still, you’re paying for dinner’ Nvidia CEO shoots back, after TSMC CEO jokes about his billionaire status

(Image credit: Unique Business News (UBN) Taiwan)

Nvidia CEO Jensen Huang is back in Taiwan for weighty negotiations with contract chipmaker TSMC. The talks are thought to be related to the new China-specific B30 chips using the Blackwell architecture. No matter the gravity of the talks, though, the Nvidia head enjoys a very cordial relationship with CC Wei, the CEO of TSMC. Their warm relationship is made clearly apparent in a video showing the two billionaires joking about who will pay the bill for dinner

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Intel

AMD comments on burning AM5 socket — chipmaker blames motherboard vendors for not following official BIOS guidelines

(Image credit: Shutterstock)

AMD has finally responded to recent socket burnout issues plaguing some third-party AM5 motherboard vendors — including ASRock. Quasarzone had a Q&A session with AMD's David McAfee and Travis Kirsch, who explained the reason behind these burnout issues.

AMD claims the underlying problem behind the burnout issues is caused by some ODM BIOSes that do not adhere to AMD's recommended values. However, AMD has further clarified that the issue is complex and is working closely with its partners to resolve

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Intel Lunar Lake-powered gaming handheld with 3D display will sell for $1,699 — 11-inch screen boasts WQXGA resolution and 120 Hz refresh rate

(Image credit: Abxylute)

Abxylute is known for producing affordable Android handheld consoles, such as the One Pro, and wireless controllers. However, it appears to be entering the premium Windows gaming segment with the launch of the Abxylute 3D One. According to VideoCardz , this “handheld” gaming device will feature a 10.95-inch screen and weigh around 1.11 kg or around 2.45 pounds. It seems to be based on Tencent’s Sunday Dragon 3D One ,

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Nvidia GPUs and Fujitsu Arm CPUs will power Japan's next $750M zetta-scale supercomputer — FugakuNEXT aims to revolutionize AI-driven science and global research

(Image credit: Shutterstock)

Japan is preparing to reclaim its position at the forefront of high-performance computing with FugakuNEXT, a hybrid AI-HPC supercomputer designed to surpass exascale and venture into uncharted zetta-scale territory. Announced at a ceremony in Tokyo on August 22, the project marks a major collaboration between RIKEN, Fujitsu, and, for the first time, Nvidia, bringing together Japan’s sovereign infrastructure and U.S. GPU technology in a system built for the next decade of scientific and industrial

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Lucky user finds 6TB of free SSD storage while dumpster diving — finder plans to use the six 1TB Samsung 850 Pro SSDs to download entire Steam library

(Image credit: Reddit/DogeBoi6 )

Some people simply discard old PC parts once they upgrade and no longer need them, especially since disposing of them can become too inconvenient. So, it’s up to Redditors like u/DogeBoi6 to find them in the dumpster and give them a second lease on life. According to the user’s post, they found six 1TB Samsung 850 Pro SSDs sitting in the trash, so they fished them out and now plan to use them to <

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Kioxia’s new 5TB, 64 GB/s flash module puts NAND toward the memory bus for AI GPUs — HBF prototype adopts familiar SSD form factor

(Image credit: Kioxia)

Kioxia has developed a prototype of the 5TB high-bandwidth flash memory module with a bandwidth of 64 GB/s. It's essentially NAND-based memory for GPUs. Compared to HBM, High Bandwidth Flash (HBF) adapts the concept to NAND flash, offering 8-16x the capacity of DRAM-based HBM. By combining speed with persistent storage, HBF enables large AI datasets to be accessed efficiently while using less power. One of these HBF modules,

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