Apple’s next-gen M5 chip is coming soon, debuting in this fall’s new iPad Pro model. But despite this being the second year in a row the iPad gets an M-class chip first, this time will be different for two key reasons.
蘋果新款MacBook Pro延期至2026年：M5轉向LMC封裝，為採用CoWoS奠定基礎
此前有 報道 稱，蘋果計劃在今年下半年推出搭載M5芯片的MacBook Pro機型，設計上與現有機型基本一致，沒有重大的改動，因此改用新款M5芯片成為了最大的亮點。傳聞M5將帶來顯着的計算和圖形性能提升，升級至台積電（TSMC）
Apple M5 Silicon Adopts LMC Packaging, Paving the Way for CoWoS
According to the well-known Apple insider Ming-Chi Kuo, Apple has reworked a part of its semiconductor supply chain by awarding Taiwan's Eternal Materials exclusive roles in supplying key packaging compounds for its 2026 iPhone and Mac processors. Eternal will supply molding underfill, known as MUF, for the A20 iPhone packages and a liquid molding compound, or LMC, for the high-end M5 Mac processors. TSMC has completed the qualification of these materials and validation for CoWoS use is underway,
Apple To Swift From InFO To Wafer-Level Multi-Chip Module Packaging For The iPhone 18’s A20 SoC In 2026, Reducing Unnecessary Production Costs As It Moves To TSMC’s 2nm Process While Boosting Efficien
The A20 and the A20 Pro will potentially be Apple’s first 2nm chipsets that will be found in the iPhone 18 series, with the company jumping to the newer lithography thanks to TSMC’s continued efforts. Unfortunately, this shift will not be cheap, as each wafer manufactured using the cutting-edge process is estimated to cost $30,000, making the Cupertino giant one of the few names that will jump on the 2nm bandwagon. However, according to
Intel is going full-AMD with its LGA-1954 socket
With four generations of planned CPU support, Intel’s LGA-1954 socket could be the change that Intel needs With its next-generation Nova Lake series of CPUs, Intel plans to move to a new CPU socket. That socket is Intel LGA-1954, and it could be a game-changer for the blue team. According to a report from Moore’s […]
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iPhone 17 Air Will Compete With iPhone 17 Pro In Performance, But Binned A19 Pro Chip With Fewer GPU Cores May Impact Gaming Frame Rates And Graphics Quality
Apple’s upcoming iPhone 17 Air is not just trying to be the thinnest iPhone ever but it is also silently gunning for the ‘Pro’ models’ performance crown. On paper, the device is shaping up to be a sleek underdog of 2025, carrying the same A19 Pro chip that powers its more expensive siblings. A new leak claims that the iPhone 17 Air will be powered by a binned A19 Pro chip, which means that it will have the same computational gains
Leaker reiterates that iPhone 17 Air will get binned GPU
A leaker last month indicated that the iPhone 17 Air would get a “binned” version of the A19 Pro chip, with only five graphics cores instead of six.
They’ve today reiterated this, affirming another of the compromises buyers will have to make if they want Apple’s slimmest ever iPhone …
Making chips with such small processes is an incredibly delicate process, where even the tiniest of fabrication glitches can result in a loss in performance. One relatively common issue can result in one or more CPU
Apple @ Work Podcast: The state of Zero Trust in the enterprise
, the only Apple Unified Platform. Mosyle is the only solution that integrates in a single professional-grade platform all the solutions necessary to seamlessly and automatically deploy, manage & protect Apple devices at work. Over 45,000 organizations trust Mosyle to make millions of Apple devices work-ready with no effort and at an affordable cost. today and understand why Mosyle is everything you need to work with Apple .
In this episode of Apple @ Work, , CEO of Tailscale, joins the show to talk about
Huawei’s new algorithm could cut China’s reliance on foreign memory chips
Huawei Technologies has unveiled a software tool designed to accelerate inference in large artificial intelligence models, an advancement that could help China reduce its reliance on expensive high-bandwidth memory (HBM) chips.
Unified Cache Manager (UCM) is an algorithm that allocates data according to varying latency requirements across different types of memories – including ultra-fast HBM, standard dynamic random access memory and solid-state drive – thereby enhancing inference efficiency, according to Huawei executives at the Financial AI Reasoning Application Landing and Development Forum in Shanghai on Tuesday
Snapdragon 8 Elite Gen 2 Registers Its First Single-Core & Multi-Core Results While Being Tested On Samsung’s Galaxy S26 Edge, Performance Cores Running At 4.74GHz Obtain Impressive Results
Qualcomm’s Snapdragon Summit is scheduled to kick off on September 23 , so it was only a matter of time before its top-tier chipset, the Snapdragon 8 Elite Gen 2, started showing up in benchmark databases. After seemingly obtaining a massive 3.8 million score in AnTuTu , making it 40.7 percent higher than the fastest Snapdragon 8 Elite-powered flagship on the app’s list, the new SoC was recently spotted running in Samsung’s ultra-slim smartphone, the Galaxy S
