Samsung was said to have lost out on acquiring any Snapdragon 8 Elite Gen 2 orders from Qualcomm, with the upcoming flagship chipset reported to be exclusively mass produced on TSMC’s 3nm ‘N3P’ process . However, fortune may be favoring the Korean giant and its quest to narrow the gap with its foundry rival because there is a possibility that one version of the Snapdragon 8 Elite Gen 2, codenamed ‘Kaanapali S,’ leverages Samsung’s 2nm GAA technology. At this time, a fresh
New homegrown China server chips unveiled with impressive specs — Loongson's 3C6000 CPU comes armed with 64 cores, 128 threads, and performance to rival Xeon 8380
Loongson has finally released the 64-core version of its 3C6000 series processors based on the LoongArch 6000 architecture. Fast Technology reports that the new chip is dubbed the 3E6000, and features performance equivalent to Intel's 80-core Xeon 8380 based on Intel's 2019-era Ice Lake architecture.
The new chip represents the flagship model of Loongson's 3C60
Trump Mobile’s T1 Phone Removes All Claims From Its Website That The Smartphone Is ‘Made In America’ And Is Now Replaced By The Terms ‘Proudly American’
President Donald Trump has long been a proponent of consumer electronics being manufactured in the United States, so much so that he even threatened Apple CEO Tim Cook with applying a 25 percent tariff on devices mass produced overseas. The current administration’s battle cry on producing goods in-house is so entrenched that Trump Mobile introduced the T1 Phone , a $499 phone that was continuously claimed to be made in America. Unfortunately, word quickly disseminated that the handset in question was actually of Chinese origin , prompting
谷歌打算跳過台積電第三代3nm工藝，直接選擇2nm製造Tensor G6
去年穀歌發佈了新款旗艦產品Pixel 9系列，全線搭載了Tensor G4，採用三星4nm工藝製造。不過今年穀歌將改變策略，用於Pixel 10系列的Tensor G5將更換代工廠，從三星變成了台積電（TSMC），預計採用第二代3nm工藝（N3E）製造，
Apple’s C1 is coming to this product next, and skipping the rest
When Apple launched its iPhone 16e earlier this year, it included a brand new component: the C1 modem . But more recent devices like the and haven’t included it. Here’s where the C1 will appear next, and which products are not expected to get it.
For many years, Apple has been working to develop its own cellular modem tech. Absent that tech being ready, the company has had to rely on Qualcomm to supply 5G modems for its devices.
While Qualcomm’
外媒確認華為麒麟 X90 使用 7nm 製程 非傳聞中的中芯 5nm 技術 與先進製程差距擴大至 3 世代
華為之前宣佈自家麒麟 X90 晶片的時候，不少評論估計它採用 5nm 製程生產，不過最近有外媒拆機進行分析，確認這處理器是採用中芯國際 7nm（N+2）製程製造，意味著中芯國際尚未實現可大規模生產的 5nm 等效製程節點
Next iPad Pro Could Arrive With Slimmest Bezels Ever, Thanks To LG’s Chip-On-Film Tech That Paves The Way For An All-Screen Design And Batter Battery
Apple's M4 iPad Pro launched more than a year ago, and there are still no signs of an upgrade from the company. The Cupertino giant is working on its next-gen M5 chip, which could be introduced later this year with the new MacBook Pro models, and we are hoping that the company will see fit to upgrade the iPad Pro as well with the same chip. However, the company also has plans to upgrade the design of the iPad Pro models with slimmer bezels, as it is
TSMC’s 35% Market Share Makes It World’s Biggest Chipmaker With Intel In 2nd Place, Shows Data
This is not investment advice. The author has no position in any of the stocks mentioned. Wccftech.com has a disclosure and ethics policy.
The Taiwan Semiconductor Manufacturing Company (TSMC) continues to be the world's largest chip foundry in an industry that includes photomask manufacturing and semiconductor assembly. The firm commands 35% of the market, according to Counterpoint Research, which also lists that Intel is the second biggest company in the industry. The research firm outlines Intel's progress with its 18A chip
(PR) Other World Computing Launches the Express 4M2 Four-slot NVMe M.2 SSD USB4 Enclosure
Other World Computing (OWC), a trusted leader in high-performance storage, memory, connectivity, software, and accessories that empower creative and business professionals to maximize performance, enhance reliability, and streamline workflows, today announced the launch of the OWC Express 4M2, a four-slot NVMe M.2 SSD USB4, Thunderbolt compatible enclosure offering improved performance, thermal protection for today's high performance drives, as well as expanded compatibility for an improved near-silent operation.
The Express 4M2
The Express 4M2
Huawei, SMIC struggle to advance chips to 5-nm level, MateBook shows: report
Huawei Technologies continues to face challenges in advancing to the 5-nanometre chip manufacturing process, an analysis of its latest laptop hardware shows, underscoring the impact of US sanctions on the Chinese telecoms equipment giant.
Canadian research firm TechInsights found that the newly launched MateBook Fold Ultimate Design laptop features Huawei’s Kirin X90 system-on-a-chip (SoC), which is manufactured by China’s Semiconductor Manufacturing International Corporation (SMIC