AMD is allegedly working on an Arm-based SoC, codenamed "Sound Wave", in a bid to power Microsoft 's Surface laptops next year, claims Kepler via ITHome . Moving away from traditional x86 designs, Sound Wave is reported to feature the Arm ISA and will likely leverage off-the-shelf Cortex cores. Details on exact specifications, availability, and pricing remain under wraps, so it's wise to approach this leak with caution.
Looking beyond its historical
Zotac is preparing to launch new mini-PC offerings at Computex next week, featuring AMD's beastly Strix Halo APUs and desktop Blackwell GPUs from Nvidia. So far, the company has showcased two designs with Nvidia hardware, featuring the desktop RTX 5060 Ti and the RTX 5070, and one AMD-based design with a Ryzen AI MAX CPU. Details on exact specifications and pricing have not been shared, but we'll hear more from the team at
AMD is reportedly developing an ARM-based CPU, the "Sound Wave" platform, which will be included in the Microsoft Surface lineup by 2026.
Well, it seems like CPU manufacturers are actually inclined towards the ARM-based platform, after its success seen with Qualcomm's Snapdragon SoCs. While AMD is a "pure-x86" driven company
最近有 報道 稱，英偉達和聯發科很可能選擇在Computex 2025推出用於Windows PC的N1系列Arm芯片。N1系列分為N1X和N1兩款，前者用於台式機，後者用於筆記本電腦，標誌着英偉達和聯發科正式進軍Windows on Arm生態系統。這是英偉達
Samsung plans to adopt hybrid bonding technology for its HBM4 to reduce thermals and enable an ultra-wide memory interface, the company revealed at the AI Semiconductor Forum held in Seoul, South Korea. By contrast, the company's rival SK hynix might delay adoption of hybrid bonding technology, reports EBN .
High-bandwidth memory (HBM) stack multiple memory devices on top of a base die. For now, memory dies in HBM stacks are typically joined together using microbumps (that carry data, power, and control
Samsung is now contending for the top spot in the chip industry, as according to reports, the Korean giant has managed to gain massive ground with 2nm.
When it comes to the race for cutting-edge nodes, there's little competition, at least right now. TSMC is reported to have been leading the operations for the 2nm process, not just by an earlier production schedule, but also
Qualcomm is reported every year to pursue a dual-sourcing strategy where it would take advantage of technologies from Samsung and TSMC for its upcoming chips. Sadly for the San Diego firm, it ends up having little choice in the matter, and chooses the Taiwanese semiconductor as the Korean foundry has failed to improve its yields time and time again.
Even with the Snapdragon 8 Elite Gen 2, it was mentioned that the upcoming flagship SoC will exclusively be mass produced on TSMC’s third-generation 3nm ‘N3P
