Apple Silicon|Intel

Trade tensions are giving Intel's older chips a second life - Reuters

Trade tensions are giving Intel's older chips a second life Reuters

Apple Silicon

Apple is launching 15+ new products later this year, here’s what’s coming

Apple has already launched five new products this year, but the company has much more in store for users. In addition to major software changes like iOS 19’s redesign , there are 15+ new Apple products in the pipeline that we’re expecting to launch before the year ends. Here’s everything that’s coming.

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Apple Silicon

TSMC’s Cutting-Edge SoW-X Packaging Set For Mass Production By 2027; Delivering 40x Higher Computing Power Than Current CoWoS Solutions

In addition to semiconductor announcements, TSMC also with advanced packaging technologies at the Technology Symposium, announcing SoW-X.

TSMC's SoW-X Packaging Technology Is Said To Take Computing Capabilities To New Heights, Offering High Performance

When it comes to the importance of advanced packaging like CoWoS, it is basically one of the ways by which companies like NVIDIA have defied Moore's Law and the usual performance increment scale we saw with previous generations of products. By combining chips onto a single wafer and substrate, CoWoS has brought


Apple Silicon|Intel

Panther Lake and Nova Lake reportedly power Intel's next-gen automotive SoCs, Intel releases new roadmap

(Image credit: Intel)

Expanding its wings into the automotive ecosystem, Intel shared its upcoming SDV (Software-Defined Vehicle) SoC designs at Auto Shanghai 2025 yesterday. Slated to be the industry's first disaggregated design, the company presented its second-generation SDV SoC, internally codenamed Frisco Lake. A detailed investigation by 3elife , a Chinese tech and news publication, purports these SoCs are derivatives of Intel's Panther Lake design, with their successor allegedly based on Nova Lake.

Software-

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Apple Silicon|Intel

TSMC chips to hit 1.4nm in 2028, with confusing name confirmed

Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028, and that the development of 1.4nm chips will allow for greater AI capabilities.

The iPhone maker is generally first in line for the company’s most advanced chipmaking capabilities, so we can expect the chips – slightly confusingly dubbed A14 – to debut in 2028 iPhones …

Up until , the sizes of chip processes referred to physical size of transistor


Apple Silicon|Intel

Intel partners with AI firm ModelBest, chip designer Black Sesame on smart car systems

Intel’s latest collaborations come amid the rapid development of intelligent cockpits in China’s electric vehicle industry. Photo: Shutterstock

The strategic partnerships were announced on Wednesday at the opening of the 10-day Shanghai Auto Show , where the US semiconductor giant made its debut to unveil the second-generation, AI-enhanced software-defined vehicle (SDV) system-on-a-chip (SoC), which it said would provide automakers with “scalable performance, advanced AI capabilities
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Apple Silicon

PCIe Controller Support For The Apple M2 Pro Coming To The Mainline Linux Kernel

The latest bit of hardware enablement coming out of Asahi Linux and queued for introduction in the mainline kernel the next cycle is PCI Express (PCIe) support for the Apple M2 Pro SoC.

There's been a set of patches for a while now for enabling the PCIe support with the Apple M2 Pro / T6020. Compared to prior Apple M-Series SoCs, some of the registers were shuffled around and thus required adjustments to the pcie-apple driver.

These Apple M2 Pro PCIe
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Apple Silicon|Intel

TSMC Plans To Commence 1.4nm Wafer Production In 2028, With The Advanced Lithography Delivering As Much As Up To 30 Percent Performance And Efficiency Improvements

The 2nm race is currently being led by TSMC because at the start of the month, the foundry giant reportedly started accepting orders for its cutting-edge wafers, with Apple likely being the first recipient of this technology. It will take a few years for the Taiwanese semiconductor behemoth to transition to the more advanced node, but we should start seeing 1.4nm chips in the distant future, as the company has said that it will kick off production for the latter in 2028. Naturally, there


Apple Silicon|Intel

TSMC shows off new tech for stitching together bigger, faster chips

A TSMC logo is seen at the Hsinchu Science Park in Taiwan. Photo: AFP

Taiwan Semiconductor Manufacturing Company (TSMC) on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate-sized packages that will boost performance needed for artificial intelligence (AI) applications.

It said its A14 manufacturing technology would arrive in 2028 and would be able to produce processors that are 15 per cent faster at the same power consumption as its N2 chips scheduled to enter production this year

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Apple Silicon|Intel

Intel’s Next-Gen Automotive SoCs Detailed: Frisco Lake With Panther Lake IP & Xe3 iGPU, Grizzly Lake With Up To 32 Nova Lake E-Cores & 7 TFLOPs iGPU

Intel has detailed its next-gen SoCs, codenamed Frisco Lake & Grizzly Lake, which incorporate Panther Lake & Nova Lake IPs at the Shanghai Auto Show.

Intel Fast Forwards Its Automotive SoC Roadmap With 2nd Gen Frisco Lake SDV SoC, Comes With Panther Lake uArch & 3rd Gen Xe Graphics, 10x AI Performance

Well, Intel just its latest Automotive plans, and they seem to be going all in with new SoC designs that incorporate their latest and greatest architectures.

Image Source: 3elife.net

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