蘋果將於北京時間2024年5月7日晚上10點舉行名為“Let Loose”的特別活動，帶來全新iPad產品。直到目前為止，蘋果在防止硬件規格泄漏方面做得很好，雖然市場上傳言不少，但是具體情況仍然沒有定論。普遍認為，蘋果將
去年聯發科（MediaTek）帶來了天璣9300，採用了“全大核”CPU架構，峯值性能相較上一代大幅度提升。傳聞今年聯發科堅持“全大核”設計，並採用台積電第二代3nm工藝（N3E），希望新款天璣9400能擊敗競爭對手高通
According to a leak from a Weibo user , Huawei's chip development unit is working on a next-generation Kirin processor for PCs in addition to releasing the HiSilicon Kirin 9010 smartphone application processor. That part will feature the company's next-generation general-purpose cores and a revamped GPU. Huawei reportedly hopes the new Kirin will compete against Apple's M3 in multi-thread workloads.
Huawei's upcoming HiSilicon Kirin processor is projected to feature eight general
Huawei's latest Pura 70 smartphone, launched earlier this month in China, is powered by the company's latest HiSilicon Kirin 9010 application processor made by China fab SMIC. The chip is based on SMIC's 7nm-class process technology , according to findings by TechInsights reported by Bloomberg . The findings demonstrate that despite the U.S. government's efforts to limit Huawei's ability to develop advanced processors and SMIC to produce them, new chips
Just when you thought that AMD's Instinct MI300X and Nvidia's B200 GPUs for AI applications were just huge, think again because TSMC is working on a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that will enable system-in-packages (SiPs) which are over two times bigger, the company announced at its North American Technology Symposium. These will use 120x1
A seller from California has briefly listed AMD’s yet unreleased EPYC 4004 series of CPUs for the AM5 socket.
AMD is about to launch AM5-based EPYC server processors, and there is now evidence that this is indeed happening. As we reported 3 days ago , AMD has apparently been planning to offer yet another CPU variant for this otherwise consumer-grade socket. The EPYC CPUs are already offered on larger SP5 and SP
The new Dell XPS 14 presents the strongest competition to Apple's MacBook Pro 14 so far, featuring a powerful CPU and GPU, as well as a fantastic OLED screen. However, it comes at a considerable cost.
TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to develop and produce. But TSMC believes that not only will wafer-scale designs ramp up in usage, but that megatrends like AI and HPC will call for even more complex solutions: vertically stacked system-on-wafer designs
TSMC is taking the wafer-scale fabrication battle into the third dimension with a new technology. At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO_SoW system-on-wafer integration technology technology that TSMC introduced in 2020 that allows it to build wafer-scale logic processors. So far, only Tesla has
