For this year's ChinaJoy expo, AMD is taking to the show to announce a new and very special mobile CPU for high-end, desktop replacement-class laptops: the Ryzen 9 7945HX3D, AMD's first V-cache-equipped mobile CPU. Slated to launch on August 22nd, the new chip is set to break new ground for AMD in the mobile space, all the while giving gamers an even more potent CPU for high-end gaming laptops.
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Huawei has ambitious plans to restart the manufacturing of high-end mobile system-on-chips as early as this year, a report by Nikkei claims. The story corroborates an earlier Reuters report that Huawei plans to use SMIC's 7nm-class fabrication technology to make its comeback to smartphone SoCs. But there is a problem that Huawei may reportedly face: high defect density of SMIC's 7nm-class node.
"However, the production yield [quality] for a
過去一段時間裏，一直有 傳言 稱AMD計劃推出一款採用大小核設計（Zen 4+Zen 4c）的APU，代號為“Phoenix 2”，使用的是面積更小的芯片。AMD高級副總裁兼首席技術官Mark Papermaster也確認，AMD的混合架構處理器會出現在消費級市場上。
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SolidRun是一家生產工控電腦，IoT設備和ARM服務器等可嵌入式邊緣計算設備的公司。援引 Liliputing 的消息，這家公司日前推出了Bedrock R7000系列設備，是基於AMD鋭龍7 7840U/7840HS處理器的被動散熱迷你電腦。
該迷你電腦的主要
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It seems that mobile power users may soon have a reason to review - and potentially upgrade - their systems. According to a Weibo post ( shared on Twitter by HXL, @9550PRO ), ASUS is readying a ROG Strix SCAR laptop that features a desktop Ryzen 9 7945HX3D chip. Given the 'X3D' moniker for the chip, this new chip will come with AMD's gaming-performance-boosting 3D V-
此前有 消息 稱，今年蘋果將帶來M3芯片用於新款Macbook機型，採用台積電（TSMC）在3nm製程節點的首個工藝N3。傳聞台積電在3nm芯片的生產上遇到一些問題，良品率一直無法提高，M3芯片的良品率僅為55%，不過似乎沒有
