Apple Silicon

Samsung to Detail SF4X Process for High-Performance Chips

Samsung has invested heavily in semiconductor manufacturing technology to provide clients with a viable alternative to TSMC and its portfolio of nodes spanning anything from mobile to high-performance computing (HPC) applications. Today, we have information that Samsung will present its SF4X node to the public in this year's VLSI Symposium. Previously known as a 4HPC node, it is designed as a 4 nm-class node with a specialized use case for HPC processors, in contrast to the standard SF4 (4LPP) node

Apple Silicon

Samsung's Next-Gen Process Technology Aims to Break Performance Records

(Image credit: Samsung)

Samsung Foundry plans to disclose more details about its upcoming SF4X process technology that will target high-performance computing (HPC) applications, such as datacenter CPUs and GPUs, at the 2023 Symposium on VLSI Technology and Circuits . The new fabrication technology — previously known as 4HPC (4nm-class, high-performance computing) will not only enable higher clocks and efficiency, but will also support increased voltages for those who need maximum performance.

Samsung's new

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Apple Silicon

蘋果正在測試M3 Pro芯片:擁有12個CPU核心和18個GPU核心

自2020年蘋果宣佈推出M系列自研芯片,全面取代原有產品線的x86處理器後,對整個行業的發展產生了重大的影響。雖然此前有 報道 稱,蘋果因台積電生產方面的問題,不打算在今年發佈M3芯片,要等到2024年,


Apple Silicon

Report: Apple Testing M3 Pro Chips With 12 CPU and 18 GPU Cores

(Image credit: Future)

Apple's transition to its own-designed M-series silicon caused shockwaves throughout the industry that are still reverberating. As it prepares to debut its latest crop of Macs with M2 chips , a highly reputable insider has shared some of the key specs of the first Apple M3 chip, which is claimed to be already in testing.

Based on his insider sources, Mark Gurman of Bloomberg outlines the upcoming Apple M3 Pro SoC as offering: 12 CPU cores, 18

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Apple Silicon

Lightweight External GPU is First to Use OCuLink Connector

(Image credit: GPD)

GPD has started a crowdfunding campaign to design and build the world's first external graphics processing system with AMD's Radeon RX 7600M XT GPU inside with OCuLink and USB4 interfaces to connect to its host, reports Notebookcheck . The unit promises to be one of the industry's smallest eGFX solutions if it gets developed and hits the market.

Standing at dimensions of 225 x 111 x 29.8 mm, the GPD G1 claims

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Apple Silicon|Intel

(PR) Samsung Develops Industry's First CXL DRAM Supporting CXL 2.0

Samsung Electronics Co. Ltd, a world leader in advanced semiconductor technology, today announced its development of the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform. Building on its development of the industry's first CXL 1.1-based CXL DRAM in May of 2022, Samsung's introduction of the 128 GB CXL DRAM based on

Apple Silicon|Intel

(PR) Samsung introduces industry’s first 128GB Compute Express Link 2.0 DRAM

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Samsung will continue collaborating with global data center, server and chipset companies to bolster CXL ecosystem

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link™ (CXL™) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel® Xeon® platform.

Building on its development of the industry’s first CXL 1.1-based CXL DRAM

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Apple Silicon

MSI Latest SSD Pushes PCIe 4 to the Limit: Up to 7.4 GB/s and 1M IOPS

(Image credit: MSI)

MSI has introduced its ultimate PCIe 4.0 solid-state drives that maximize sequential and random read and write performance to provide the best experience possible. MSI's Spatium M480 Pro SSDs are designed to maximize the storage performance of previous-generation PCIe Gen4-supporting platforms and will therefore be able to address tens of millions of PCs released in the last four years.

Just like other members of MSI's Spatium M480 family , Spatium M48

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Apple Silicon|Intel

ASRock Launches Alder Lake-N Mini-ITX, Micro ATX Motherboards

N100DC-ITX (Image credit: ASRock)

ASRock has revealed the N100M and N100DC-ITX motherboards for small-form-factor (SFF) systems. The two new motherboards leverage Intel's low-powered Alder Lake-N processors, specifically, the N100.

Alder Lake-N, a product of the Intel 7 node (previously known as the 10nm SuperFin process), is essentially Alder Lake without the P-cores

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Apple Silicon|Intel

(PR) IBASE Announces Rugged COM Express CPU Module with Intel Atom x6000 Processors

IBASE Technology Inc., a leading provider of industrial motherboards and embedded computing solutions, has announced the release of its latest ET880 COM Express CPU module designed to meet the demands of embedded applications that require low power consumption and fanless operation. The module integrated Intel Atom x6000 series processors that are built on 10 nm technology support clock speeds of up to 3.2 GHz and Intel's Time Coordinated Computing (TCC) technology, which enables precise clock synchronization across multiple devices.

The