Up until recently, Apple and NVIDIA maintained neat and clearly delineated orbits within TSMC's sprawling fabs, with the former leveraging the fab giant's leading-edge process and InFO (Integrated Fan-Out) packaging tech for its A-series processors, while the latter continuing to utilize TSMC's older-gen process alongside CoWoS (Chip-on-Wafer-on-Substrate) packaging technology for its GPUs.
Yet, as both Apple and NVIDIA adopt a more aggressive design language for their bespoke chips,



