根據彭博社（Bloomberg）報導 ，Apple正計畫在裝置中擴大採用自家設計的晶片，包括預計將在2025年放棄使用博通（Broadcom）Wi-Fi和藍牙晶片。另外，Apple原本也將在新的iPhone上，使用自家基頻晶片代替高通（Qualcomm）晶片，不過目前這項計畫
Jan 9 (Reuters) - Apple Inc (AAPL.O) plans to drop a Broadcom Inc (AVGO.O) chip used in its devices in 2025 and use an in-house design instead, Bloomberg News reported on Monday citing people familiar with the matter.
The iPhone maker has been working to limit its reliance on other chipmakers, having moved to its own line of chips for recent models of its Mac computers, replacing those from Intel Corp (INTC.O) .
Apple plans to replace
Apple has one more computer to convert to Apple Silicon: the Mac Pro. And it sounds like it will be more familiar than we expected. According to Mark Gurman's "Power On" newsletter for Bloomberg , an upcoming refresh will appear identical to the 2019 version.
To some, that's a bit of a shame, as many of Apple's designs featuring its own silicon have been
毫無疑問，台積電（TSMC）在接下來的幾年裏，依然為AMD生產CPU、GPU、SoC和FPGA，比如使用N3、N4和N5工藝製造基於Zen 4和Zen 5架構的芯片，同時由自家分離的格羅方德（GlobalFoundries）會採用14LPP和12LP工藝生產像Zen+架構這樣的
It looks like AMD's latest AGESA ComboAM5PI 1.0.0.4 firmware has done more harm than good. As tipped by hardware leaker chi11eddog (opens in new tab) , the firmware reportedly disables some cores on the Ryzen 5 7600X , prompting various motherboard vendors to pull the update from their websites.
The flawed firmware doesn't affect all Ryzen 5 7600X, one of the
TSMC remains poised to produce CPUs, GPUs, SoCs, and FPGAs for AMD on its leading-edge fabrication processes for years to come. However, AMD will keep outsourcing production of its older products to GlobalFoundries and Samsung Foundry, according to DigiTimes . Given the current geopolitical situation, one might speculate that the chip designer is exploring SF as a potential alternative not only to GF, but to TSMC as well.
DigiTimes claims that TSMC will make Zen 4 and Zen 5
AMD today released its first mobile discrete GPUs based on its latest RDNA3 graphics architecture, the Radeon RX 7600M series, and the RX 7600S series. Although based on the latest architecture, AMD decided to built these GPUs on monolithic 6 nm dies, along with many of the power-management features incorporated from Ryzen 6000-series "Rembrandt" processors. The unnamed silicon these GPUs are based on physically features 32 RDNA3 compute units (2,04
AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM)
While many companies such as Razer offer 'desktop' replacements in the form of very high-end and powerful gaming laptops, the silicon that goes into them not only needs to deliver similar levels of performance but it's got to be efficient too. With high-end mobile processors coming out at least once a year, during their opening keynote at CES 2023, AMD CEO Dr. Lisa Su unveiled the latest in AMD's Ryzen mobile products for the high-end laptop space, the Ryzen
This year’s CES has turned out to be a laptop-centric event in the PC space, and no farther do you have to look for proof of that than AMD’s CES keynote. The densely packed keynote immediately kicked things off with the announcement of AMD’s 2023 mobile product stack, which will see the CPU vendor mixing and matching silicon across multiple generations of designs to put together a fresh product stack for the new year. This includes the return of some old favorites, including bringing