蘋果在WWDC 2022開發者大會上發佈了全新的MacBook Air，上面搭載了全新一代的M2芯片，開啟了M2系列自研芯片的序幕。此前有報道稱，蘋果將會在今年底帶來新款14英寸和16英寸MacBook Pro，將升級到M2 Pro和M2 Max芯片。此外

高通在去年11月底的驍龍峯會上發佈了驍龍8 Gen 1處理器，如果高通今年繼續延續這發佈節點的話，今年第四季度我們就能看到新的驍龍8 Gen 2處理器，這將會成為2023年高端安卓手機搭載的旗艦SoC。

高通的驍龍峯會是一

近日，加拿大宇航員Chris Hadfield（曾在空間站演唱David Bowie的《Space Oddity》而走紅）在自己的社交媒體賬號上 表示 ，歐洲航天局的火星探測衞星Mars Express（火星快車號）將迎來軟件 更新 ，以更好地尋找火星的地下水，並研究和監測火星的衞星火衞一

此前AMD更新了GPU的RDNA/CDNA系列架構路線圖，其中已確認Instinct MI300系列會提供多種規格，其中一款是APU，將Zen 4架構和CDNA 3架構的模塊以及HBM內存堆棧封裝在一起。據HPC Wire 報道 ，在橡樹嶺國家實驗室（ORNL）舉行的第79屆HPC用户

One area of AMD's portfolio that perhaps doesn't garner the same levels of attention as its desktop, mobile, and server products is its embedded business. In early 2020, AMD unveiled its Ryzen Embedded R1000 platform for the commercial and industrial sectors and the ever-growing IoT market, with low-powered processors designed for low-profile systems to satisfy the mid-range of the market.

At Embedded World 2022 in Nuremberg, Germany, AMD has announced

MediaTek today announced the Dimensity 9000+, an enhancement to the company's top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.

The new Dimensity 9000+ system-on-chip (SoC) integrates Arm's v9 CPU architecture with a 4 nm octa-core process, combining one ultra-Cortex