AMD AGESA 1.2.0.3 Patch C BETA BIOS是上個月發佈的Patch B的擴展，一方面提供了對Ryzen 5000G系列（Cezanne）APU與Ryzen 5000系列（Vermeer B2 Stepping）處理器的進一步支持，另一方面還解決了此前Ryzen 5000系列主板上所有的USB問題。華碩是首
July 30 (Reuters) - Apple Inc's (AAPL.O) chip supplier Taiwan Semiconductor Manufacturing Co (2330.TW) said on Friday that some of its production lines in southern Taiwan were hit by a contamination of gases used in the chipmaking process.
TSMC does not expect the incident to have significant impact on operations, it said in an emailed statement to Reuters.
Nikkei, which first reported the news, said the company's most advanced chipmaking facility, Fab 18, was
TAIPEI -- Taiwan Semiconductor Manufacturing Co.'s most important plant for supplying Apple processors has been hit by a contamination of gas used in the chipmaking process, the company said on Friday.
The factory -- dubbed Fab 18 -- is the company's most advanced chipmaking facility. All of the latest processors for upcoming iPhones and Mac computers are produced there, industry sources told Nikkei Asia.
"Some gas supply in one of our plants in the southern Taiwanese city of Tainan seemed to be contaminated and the
AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation
AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation
此前有傳言指，高通下一代旗艦SoC的開發代號為SM8450，其正式名稱為驍龍895，將採用三星4nm工藝製造。據Wccftech 報道 ，這款SoC的正式名稱並不是驍龍895，而是驍龍898，其配置的Cortex-X2超大核心頻率將達到3.
YuuKi_AnS (via MacRumors ), a hardware blogger with access to rare and unreleased server hardware as well as a good track record, has indicated that Apple may use Intel's Xeon W-3300-series 'Ice Lake-SP' CPUs for its next-generation Apple Mac Pro. He is not alone with this information.
It turns out that we now have claims from three sources indicating that Apple's upcoming high-end desktop workstation will use Intel
在 Apple 的旗艦級 Destop 設備 – Mac Pro 原本有傳將會用上新一代 M2 自研晶片，不過最新消息卻顯示下一代 Mac Pro 系列只會搭載 Intel Xeon 處理器。
根據外媒 WCCFTech 引用的消息指，Apple 正為 2022 款 Intel Mac Pro 工作站選用該 Intel Xeon 處理器。若屬實則代表 M2 晶