Apple Silicon

Apple’s custom Wi-Fi chip gives the iPhone 17 a notable boost, according to speed tests

Ookla has found that Apple’s custom N1 networking chip that integrates the Wi-Fi 7, Bluetooth 6, and Thread radios in the iPhone 17 family “delivers a clear step-change in real-world Wi-Fi performance” when compared to the Broadcom chip used in the iPhone 16 models. In North America, the iPhone 17 family also outperformed flagship Android […]

Apple Silicon|Intel

Intel Panther Lake APU could take the fight to AMD in handheld gaming PCs


Hardware leaker OneRaichu recently revealed basic specifications for the integrated graphics chips in Intel's upcoming Panther Lake mobile processors. One of these chips appears intended for future handheld gaming PCs, potentially to compete with AMD's Ryzen Z2 series.

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Apple Silicon|Intel

Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech

(Image credit: Apple)

A few months ago, we reported that Intel and Apple were reportedly in preliminary discussions to find ways to collaborate with each other. But since then, there have been no details on what type of collaboration the two companies might be cooking up, until now. An Apple job listing for " DRAM Packaging Engineer " has cropped up, mentioning EMIB and 2.5D, suggesting Apple could partner with Intel to package its future processor designs, similar to Nvidia. This new posting also follows

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Apple Silicon|Intel

Apple, Broadcom, and Qualcomm Could Tap Intel Advanced Packaging for Next-Generation Chips

Apple, Broadcom, and Qualcomm might soon become customers of Intel Foundry, but not for the typical reasons. These giants are considering Intel Foundry for its advanced packaging technologies, which could allow Intel to significantly increase its foundry revenue without manufacturing the actual silicon. Job listings from Apple, Broadcom, and Qualcomm highlight Intel's Embedded Multi-die Interconnect Bridge (EMIB) as a key requirement for packaging engineer positions. This suggests they are keen on hiring engineers familiar with Intel's EMIB technology to help design their next

Apple Silicon|Intel

Apple, Broadcom, and Qualcomm May Tap Intel Advanced Packaging

Apple, Broadcom, and Qualcomm might soon become customers of Intel Foundry, but not for the typical reasons. These giants are considering Intel Foundry for its advanced packaging technologies, which could allow Intel to significantly increase its foundry revenue without manufacturing the actual silicon. Job listings from Apple, Broadcom, and Qualcomm highlight Intel's Embedded Multi-die Interconnect Bridge (EMIB) as a key requirement for packaging engineer positions. This suggests they are keen on hiring engineers familiar with Intel's EMIB technology to help design their next

Apple Silicon

Survey data shows Wi-Fi speeds are much faster on iPhone 17, thanks to Apple N1 chip

Speedtest.net’s owner Ookla has detailing Wi-Fi performance of iPhone 17 users in the wild. The data shows that the new iPhones gets significantly faster WiFi speeds compared to iPhone 16, showing the benefits of the new Apple-designed N1 chip.

The new N1 chip can be found in iPhone 17, iPhone 17 Pro and iPhone Air. The new iPhone lineup achieves faster download and upload speeds in every region that Ookla tracks.

Overall, average download and upload speeds on iPhones

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Apple Silicon

彭博: 傳 Apple 已放棄 Mac Pro 專業電腦將只有 Mac Studio 跳過 M4 Ultra 直接出 M5 Ultra

彭博新聞記者 Mark Gurman 報導指出,Apple 據報已放棄 Mac Pro 產品線。其 M4 Ultra 晶片開發計劃亦已取消,原定搭載該晶片的 Mac Pro 更新型號亦將擱置。這款 Apple 最強工作站 2023 年才更新至 M2 Ultra 處理器,短期內將不會再有任何更新計劃。

M4


Apple Silicon

蘋果或放棄Mac Pro:今明兩年都沒有更新計劃,將Mac Studio視為替代品

蘋果在WWDC 23大會上發佈了眾多新硬件,其中包括了搭載M2 Ultra的Mac Pro,整個Mac產品線過渡至自研芯片計劃至此圓滿達成。再過一個多月就要進入2026年,可是依然沒有Mac Pro升級的消息,要知道自研芯片已經來到M5系列。

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Apple Silicon

Apple Views Its Mac Studio As The New Mac Pro And Has ‘Largely Written Off’ Its Tower Workstation, M5 Ultra May Only Be Found In One Model

The current-generation Mac Pro didn’t get treated to the M3 Ultra this year, unlike the Mac Studio, as Apple’s tower workstation is still limited to the older M2 Ultra . If the writing on the wall was not obvious already, a new report states that the Cupertino firm is internally viewing the Mac Studio as the new Mac Pro, hinting that the latter might not feature the same hardware. To be fair, ever since we entered into the Apple Silicon era in 2020


Apple Silicon|Intel

Intel cancels 8-channel “Diamond Rapids” Xeon 7, shifts focus to 16-channel variants

Intel drops mainstream 8-channel Diamond Rapids Xeon from roadmap

Intel has cancelled its next-generation mainstream Xeon platform based on the 8-channel Diamond Rapids design. This part was planned as the successor to today’s Granite Rapids-SP Xeon 6700P/6500P series and would have kept the cheaper, smaller-socket 8-channel option in the lineup.

Per Serve The Home report, the change follows a roadmap review under new data center leadership. Intel told STH it has

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