Apple Silicon|Intel

(PR) Intel Launches Lakefield Hybrid Processors: Uncompromised PC Experiences for Innovative Form-Factors

Today, Intel launched Intel Core processors with Intel Hybrid Technology, code-named "Lakefield." Leveraging Intel's Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.

"Intel Core processors with Intel Hybrid Technology are the touchstone of Intel's vision for advancing the PC industry by taking an experience-based approach to designing siliconNone

Apple Silicon|Intel

Intel Details Lakefield With Hybrid Technology

Intel has provided more public details today on their hybrid processor efforts, initially with their "Lakefield" CPUs for small form factor devices...


Apple Silicon|Intel

(PR) Intel announces Core i5-L16G7 and i3-L13G4 “Lakefield” processors

Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens What’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors. “Intel Core processors with Intel HybridNone

Apple Silicon

TSMC reportedly on schedule for 3nm process fabrication line installation

In context: Taiwan Semiconductor Manufacturing Company (TSMC) is on track to start volume producing chips based on its 3nm manufacturing process by the second half of 2022. If true, we could be on the cusp of a major advancement in mobile processing technology.

According to a recent report from DigiTimes , the semiconductor foundry “has been engaged in the installation of 3nm process fabrication lines and related facilities” and is still on schedule to complete the project as originally planned. TSMC will reportedly be ready for

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Apple Silicon

GIGABYTE Intros B550 VISION D Motherboard for Creators

GIGABYTE today introduced the B550 VISION D socket AM4 motherboard targeted at creators. Built in the ATX form-factor, the board supports socket AM4 Ryzen 3000 "Matisse" processors, and is based on the new AMD B550 chipset. Within GIGABYTE's product stack, the B550 VISION D is positioned above its B550 AORUS Master flagship board based on this chipset. The board draws power from a combination of 24-pin ATX andNone
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Apple Silicon|Intel

Apple could announce its move to ARM-based Macs at WWDC

Recap: Early Macintosh computers were powered by Motorola processors but in the mid-90s, Apple switched over to PowerPC. Roughly a decade later, Apple again changed its tune, opting to outfit its computers with hardware from Intel.

Apple may be weeks away from publicly revealing plans to outfit its Mac computers with ARM-based processors.

Sources familiar with the matter tell Bloomberg that Apple could make

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Apple Silicon

Apple to Announce its own Mac Processor at WWDC (Late June)

Apple is planning to launch its own high-performance processors designed for Macs at the 2020 WWDC, held in the week of 22 June, 2020. This would be the the first step among many toward the replacement of Intel processors and the x86 machine architecture from the Apple Mac ecosystem, in the same fashion as the company replaced PowerPC with x86 last decade. Apple has codenamed the process of graduating to the new machine architecture "Kalamata," and besides detailing theNone

Apple Silicon|Intel

Report: Apple's ARM-Mac CPU Announcement Coming at WWDC

Apple logo
(Image credit: Shutterstock)

According to a Bloomberg report , Apple is set to announce plans to move to its own CPU designs for Macs at WWDC, the week of June 22. The CPUs are said to be ARM-based, and manufactured by TSMC at the 5nm process.

This news does not come as a total surprise, as there have long been rumors of Apple developing its own CPU design so that it can reduce its reliance on Intel.

Apple's motive to make itself more independent from


Apple Silicon|Intel

明年AMD移動端處理器是雙架構並行,Lucienne將接替Renoir

今天有人 在Twitter上面曝出 了一款代號為Lucienne的AMD處理器,並給出了它的CPUID及製程信息。從CPUID看,它和Renoir屬於同一家族。

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其實在寫未來 路線圖彙總 的時候,我還保留了一部分信息。明年AMD在移動端的佈局是比較複雜的,除了有基於Zen 3


Apple Silicon|Intel

AMD confirms higher clock speeds on its next-generation RDNA 2 graphics cards

Expect boosted IPC and increased clock speeds. A Win-Win for PC Gamers.
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