Apple Silicon|Intel

Samsung Unveils Intel-based Galaxy Book S: Intel’s Lakefield Inbound

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Samsung this morning is taking the wraps off of the long-awaited Intel (x86) version of the company’s popular ultraportable, always-connected laptop, the Galaxy Book S. First teased by Samsung late last year , the Intel-based version of the laptop is set to join their existing Qualcomm 8cx-based model, swapping out the Arm SoC for Intel’s latest foray into ultra-mobile processors, Lakefield. The Intel Galaxy Book S will be the first device to ship with Lakefield

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Apple Silicon|Intel

TSMC 5 nm+ Node Manufacturing Goes High-Volume in Q4, AMD one of the Major Customers

TSMC is working hard to bring the best silicon out there, with the company supplying many of the companies like NVIDIA, AMD, Huawei, and Apple - all customers who demand the latest and greatest when it comes to the silicon technology. According to sources close to DigiTimes, TSMC is expected to kick-off volume production of its next-generation 5 nm+ manufacturing node, which is an enhancement of the 5 nm node, as soon as Q4 of this year hits.

Update May 29th : TheNone

Apple Silicon|Intel

(PR) Samsung Launches the Galaxy Book S, Featuring Intel "Lakefield"

Samsung Electronics today announced the availability of Galaxy Book S with Intel processor, the latest addition to its leading computing device family. To ensure consumers have access to a wide range of computing devices to best fit their lifestyle, Samsung introduces the Galaxy Book S powered by the new dynamic Intel Core processor with Intel Hybrid Technology. Galaxy Book S joins other previously announced premium mobile laptops, designed to offer a seamless and connected experience across devices. Galaxy Book S is built for the next generation of users who are looking for a computingNone
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Apple Silicon|Intel

第五代鋭龍處理器的代號是Warhol,繼續用Zen 3架構7nm工藝

本週稍早時我們整理了一份 Intel和AMD未來處理器線路圖 的消息,目前AMD主流平台處理器也就是第三代Zen 2架構鋭龍處理器的代號是Matisse,而今年即將發佈的第四代Zen 3架構的鋭龍處理器代號是Vermeer,預計2022年會發布的Zen 4架構處


Apple Silicon

Mainline Linux Kernel Starts Seeing A NVIDIA Tegra X1 Video Input Driver

While the Tegra X1 SoC (Tegra210) has been available for several years, finally with the upcoming Linux 5.8 kernel is a mainline driver contributed by NVIDIA for the video input support...


Apple Silicon|Intel

AMD 5th Gen Ryzen Desktop Possibly Codenamed "Warhol"

Earlier this week, we brought you a report about codenames of AMD processors that won't launch before 2022. It referenced "Raphael" being distant 5 nm "Zen 4" based successor to today's "Matisse." At the time, the codename for the 2021 release of AMD's mainstream desktop processor wasn't known. We're now getting a pointer as to what it is - "Warhol."

Named after American artist and filmmaker Andy Warhol, thisNone

Apple Silicon

The Raspberry Pi 4 now has an 8GB variant and a 64-bit Raspberry Pi OS

The Raspberry Pi has just received a huge memory bump.

Apple Silicon|Intel

OPPO挖角聯發科及其他芯片廠人才,要進軍芯片領域

綜觀目前市場上各大手機廠,蘋果、三星及華為等都有自己的IC設計團隊,蘋果更幾乎是將應用處理器(AP)、圖形處理器(GPU)及各種關鍵IC組件自行研發,僅將存儲及電源管理IC等外購,目的是為了讓產品能夠達到最佳體驗


Apple Silicon

8GB Raspberry Pi 4 Launched For $75 USD

The Raspberry Pi Foundation has announced a new Raspberry Pi 4 with 8GB of RAM...


Apple Silicon|Intel

(PR) Antec Announces Intel LGA1200 Compatibility

Antec Inc., the leading provider of high-performance computer components and accessories for the gaming, PC upgrade, and Do-It-Yourself market, is happy to announce that all current 115x compatible CPU water blocks and air coolers are also compatible with the new Intel LGA 1200 socket, utilized on motherboards supporting the 10th generation of Intel Core processors. The new socket was very recently launched along with the Z490 motherboards that support the latest Comet Lake-S IntelNone
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