HiSilicon, Huawei's elite chip division, has placed 14nm orders with Semiconductor Manufacturing International (SMIC), China's top chipmaker, instead of TSMC, according to a DigiTimes report today citing unnamed industry sources.
HiSilicon's Kirin 710 smartphone processor, which is based on TSMC's 12nm FinFET node, has been out since mid-2018. There is a rumor that HiSilicon is planning to release a gimped variant of the Kirin
Current Pixel phones (and most Android smartphones in general) are all powered by Qualcomm Snapdragon SoCs. It looks like Google may take the Apple route and ditch Qualcomm in favor of its own custom-designed silicon per a report
Apple unveiled the revamped iPad Pros alongside an updated MacBook
上個月蘋果發佈了新款iPad Pro，雖然是新款，但它的處理器卻是基於A12架構的A12Z，而非人們想象中的那顆A13X。Z這個字母后綴也是首次出現在蘋果的處理器上，它比原版A12X要多一個GPU核心，實際上，A12
Last month Apple introduced its latest generation of iPad Pro tablets , and much to the surprise of many, the new iDevices didn’t come with a high-end variant of Apple’s newest A13 SoC. Instead, the iPads used an SoC that Apple was calling the A12Z, clearly indicating that it was based on the same Vortex/Tempest architecture as the earlier A12X , which was used in the 2018 iPad Pros. The unusual move from Apple left us
Despite the downturn of events around the world, TSMC is witnessing a significant increase in demand for its Chip-on-Wafer-on-Substrate (CoWoS) packaging, according to DigiTimes ' unnamed industry sources. The Taiwanese silicon manufacturer is purportedly running its CoWoS production lines at full capacity.
CoWoS as is a 2.5D method of packaging multiple individual dies side-by-side on a single silicon interposer. The benefits are the ability to increase the density in small devices as
Intel's open-source teams have been issuing a slew of new packages in recent days...
微軟在去年的Surface新品發佈會上發佈了旗下兩款雙屏產品，分別是屏幕較小的運行Android系統的Surface Duo，這是一款可以打電話的Surface設備；屏幕較大的運行Windows 10X系統的Surface Neo。根據微軟當時的計劃，兩款產品預計會在今年聖誕節期間上市
A wonderful thing about today's benchmarking tools is that many of them upload results to online databases, giving us sneak peeks at upcoming hardware before their announcements. The latest to fall victim to this trap are AMD's Ryzen 3250C and 3700C, which are CPUs that appeared to have been benchmarked off a "Google Zork" device.
The chips surfaced in the Geekbench databases ( Geekbench 4 and Geekbench 5 ), as spotted by NotebookCheck , with