AMD Ryzen Threadripper 3990X Windows 10 專業版效能差太遠？ 一切都是 Windows 的錯！
隨著 AMD Ryzen Threadripper 3990X 正式解禁，手上有 CPU 的媒體都爭先進行測試 […]
Intel 神秘 10nm 14C28T 處理器曝光 同時脈下效能增加 54%
近日有人發現在 GeekBench 測試資料庫中見到一顆疑似 Intel 10nm Ice Lake-SP伺服 […]
ASRock claims 5 world records with its TRX40 Taichi and AMD's Ryzen Threadripper 3990X
SPLAVE's proving that ASRock's motherboards can deliver world-class overclocking.
(PR) ASRock TRX40 Taichi Helps Break 5 World Records and Reaches 5748.66 MHz
The leading global motherboard, graphics card and mini PC manufacturer, ASRock, is proud to announce that by using ASRock TRX40 Taichi motherboard, the global famous overclocker, Splave breaks a total of five world records on AMD Ryzen Threadripper 3990X. Also, Splave has overclocked the highest CPU frequency for AMD Ryzen Threadripper 3990X with 5748.66 MHz.
For those looking for a motherboard that dedicates to overclocking and achieving remarkable performance, the TRX40 Taichi is
For those looking for a motherboard that dedicates to overclocking and achieving remarkable performance, the TRX40 Taichi is
Linux 5.7 To See USB Fast Charge Support For Apple iOS Devices
The Linux 5.7 kernel that will be out in the late spring / early summer is poised to see support for USB fast charging support for Apple iOS devices...
蘋果或許在5G iPhone上自己設計天線，因為高通模塊會讓手機不夠輕薄
根據目前已有的爆料消息，蘋果今年秋季推出的iPhone 12（暫時這麼叫吧）應該是都會支持5G網絡的了，而且，基帶上應該是使用了高通最新的驍龍X55。關於蘋果的5G iPhone，最早的“官方”消息應該是去年高通發佈驍龍86
[XF 推介] 小財唔出 大速度唔入 | MacBook 簡易升級 10GbE 網絡
蘋果 Apple 每年都會推出不同新 Mac 機種，最近就有 MacBook Pro 16 高性能行動電腦，其 […]
Clevo桌面級CPU筆記本即將更新：為10核i9而生
自從Intel從四代酷睿取消了移動CPU的PGA封裝後，筆記本要想升級CPU就只能夠採用桌面級產品。Clevo藍天作為最早一批採用桌面CPU的ODM廠商，在多年前推出P750/P770以及後續小改款P775後，就再也沒有推出過旗艦級的筆
ChromeOS代碼透露AMD在為Chromebook打造新處理器
雖然AMD的鋭龍移動處理器已經發展到了第四代，不過現在AMD為Chromebook所提供的處理器依然是舊的28nm推土機架構的產品A4-9120C和A6-9220C，不過隨着AMD向各個平台推廣Zen架構處理器之後這一情況將會有所改變。
(PR) Intel Zooms in on "Lakefield" Foveros Package
The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel's Foveros advanced packaging technology allows Intel to "mix and match" technology IP blocks