Apple Silicon|Intel

(PR) Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric

Cadence today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications. Cadence and TSMC have collaborated closely across the spectrum from AI-driven EDA to 3D-ICs to IP and photonics, enabling the world's most advanced semiconductors.

Cadence and TSMC have worked together on design infrastructure for advanced process nodes, including TSMC N3, N2 and A16, using Cadence

Apple Silicon|Intel

(PR) Qualcomm Reveals the Snapdragon X2 Elite Extreme and Snapdragon X2 Elite

Qualcomm Technologies, Inc. today announced Snapdragon X2 Elite Extreme and Snapdragon X2 Elite, the next-generation premium-tier platforms within the Snapdragon X Series portfolio. With superior performance, multi-day battery life and groundbreaking AI, these new processors are the fastest, most powerful and efficient processors for Windows PCs.

Ultra-premium performance for the pros
Snapdragon X2 Elite Extreme is built for ultra-premium PCs, tackling agentic AI experiences, computationally intense data analytics, professional media editing and scientific research. Ultimate
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Apple Silicon

Google reveals its Android for PC is coming next year

One of the biggest stories out of Qualcomm’s Snapdragon Summit in Maui isn’t just about Qualcomm — it’s how Google is finally merging Android and ChromeOS to create a new operating system for computers. Qualcomm CEO Cristiano Amon revealed that it’s finally happening, and now, a Google exec has revealed when it’s happening, too. It’s […]

Apple Silicon

Qualcomm announces the Snapdragon 8 Elite Gen 5

Qualcomm has formally unveiled its latest flagship SoC, destined for Android flagships in the very near future: the Snapdragon 8 Elite Gen 5. The name was revealed by way of a blog post last week, and if it seems like the company skipped forward a generation or two, that’s kind of the point. It features […]

Apple Silicon|Intel

Qualcomm Announces X2 Elite SoCs - Up To 18 Cores & Up To 5.0GHz Boost Frequency

Qualcomm today announced the Snapdragon X2 Elite SoCs as building off their X Elite laptop SoCs that shipped last year. With the Snapdragon X2 Elite Extreme (X2E-96-100) flagship is 18 cores with a 5.0GHz single and dual core boost frequency.

Qualcomm used the Snapdragon Summit for talking up the X2 Elite SoCs today, including the 12-core X2 Elite X2E-80-100, 18-core X2
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Apple Silicon|Intel

Qualcomm announces Snapdragon X2 Elite and Extreme for Windows PCs

Last year, after well over a decade of trying, Qualcomm finally made Windows on Arm laptops a thing, putting both Intel and AMD on notice and shoving Intel out of consumer-grade Microsoft Surface machines. Today, we’re learning about the second generation of the chip that made it happen, one which’ll now come in two distinct […]

Apple Silicon

Qualcomm's Snapdragon 8 Elite Gen 5 puts a 4.6 GHz processor in your pocket

Qualcomm's new Snapdragon 8 Elite Gen 5 is here, and it packs a lot of power into your pocket.

Apple Silicon

PC向け「Snapdragon X2 Elite Extreme」はメモリ統合で75%性能向上

Qualcommは、米国時間9月24日に報道発表を行ない、Windows PC向けのSoC「Snapdragon X2」シリーズの最初の製品となる「Snapdragon X2 Elite Extreme」および「Snapdragon X2 Elite」を発表した。両製品は、これまでのフラグシップ製品である「Snapdragon X Elite」の後継で、従

iPhone 17|Apple Silicon

Why iPhone 17 Pro doesn’t have Apple’s new C1X modem

Apple has a lot of silicon advancements in its latest iPhones, including the A19 and A19 Pro, new N1 wireless chip , and its next-gen C1X 5G modem. When asked why iPhone 17 and iPhone 17 Pro didn’t get the new C1X, here’s what Apple said.

This year Apple has shipped not one, but two brand new in-house cellular modems. After years in development, Apple’s first 5G modem—


Apple Silicon|Intel

(PR) Alphawave Semi Taped-Out Industry Leading 64 Gbps UCIe IP on TSMC 3 nm

Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, today announced the successful tapeout of the industry's leading 64 Gbps UCIe die-to-die (D2D) IP subsystem on TSMC's 3 nm process technology. Building on its 36 Gbps Gen 2 silicon success, this third-generation subsystem delivers a major advancement in performance and shoreline bandwidth density for the IP Ecosystem. With 64 Gbps per-lane uni-directional data
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