ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges of next-generation AI and high-performance computing data centers.

ASUS Optimized Liquid-Cooling Solutions for next-generation AI compute density
As AI and HPC workloads push compute density and power consumption beyond the capabilities of traditional air cooling, optimized liquid-cooling solutions by ASUS will provide the critical thermal management required for the next-generation NVIDIA Vera Rubin NVL72 system based data centers. By efficiently dissipating heat from high-performance CPUs, GPUs, and accelerator-dense racks, ASUS significantly reduces energy consumption, lowers PUE, and optimizes TCO while supporting unprecedented rack density.