This webcast is still ongoing over at the Intel newsroom . Meanwhile some of the live updates from the event are being posted below.
While not specifically Linux focused, Intel's process/packaging advancements are always interesting from the hardware perspective. The quick highlights include:
- New node naming to avoid confusion among process nodes. Succeeding 10nm SuperFin will be "Intel 7" (rather than "Enhanced SuperFin") and other naming beyond that -- Intel 4, Intel 3 -- and then through the angstrom era of semiconductors.
- Intel is now manufacturing more 10nm wafers than 14nm,
- Intel 7 is looking at a 10~15% improvement in performance per Watt over 10nm SuperFin. Intel 7 will begin shipping later this year with Alder Lake and then Sapphire Rapids next year.
- Intel 4 will begin appearing in products in 2023 (production beginning in H2'22) with Meteor Lake and Granite Rapids.
- Intel 4 will fully embrace extreme UV lithography.
- Intel 3 will begin manufacturing in H2'23. Intel 3 will deliver around an 18% transistor performance-per-Watt improvement over Intel 4.
- Intel 20A with volume production in 2024 will feature a new transistor architecture with new technologies RibbonFET and PowerVia.
- Intel 18A is in development for early 2025 for delivering "unquestioned leadership."
- EMIB packaging is delivering 2x bandwidth density and 4x better efficiency over standard packaging.
- Amazon's AWS is the first IFS customer.
- Qualcomm is interested in Intel's 20A process.