Intel Panther Lake-H die shots reveal tiled mobile chip design
Source: Kurnal
Annotated die shots of Intel’s Panther Lake-H processor have surfaced online, offering a closer look at how the company’s next mobile chip is physically laid out. The images were shared by Kurnal, who decapped the processor and posted separate views of the compute, GPU, and I/O tiles.
The photos show that Panther Lake-H continues Intel’s tiled design approach. Instead of using one large monolithic die, the processor is split into multiple sections that handle different tasks. That includes the main compute tile, a separate graphics tile, and an I/O tile for external connectivity.
This is the first time we can see Xe3 architecture up close, as featured in this die shot for the Arc B390 GPU featuring 12 cores:
Panther Lake GPU tile, Source: Kurnal
Arc B390 is the top integrated GPU in Intel’s Panther Lake-H lineup, used on the Core Ultra X9 388H and Core Ultra X7 368H and 358H. Intel’s specs show a 12 Xe-core design clocked at up to 2.5 GHz, with ray tracing support and up to 122 peak Int8 TOPS. The compute tile is made on Intel 18A, while the GPU tile uses TSMC N3E. Intel also has lower Panther Lake variants, such as the Core Ultra 5 338H with Arc B370 and 10 Xe-cores, so the full B390 configuration is limited to the higher-end SKUs.
The top Panther Lake-H configuration includes a mix of performance cores, efficiency cores, low-power efficiency cores, cache, memory interfaces, and a large NPU block. The GPU tile and I/O tile are shown separately, making it easier to see how Intel divided graphics and connectivity functions across the package.
Panther Lake CPU tile, Source: Kurnal
One of the more interesting details is that the compute tile appears less clear in the photos than the other sections. This is most likely tied to Intel’s PowerVia backside power delivery used on the 18A-made compute tile. By comparison, the GPU tile is easier to see, which helps highlight the internal layout more clearly.
Panther Lake I/O tile, Source: Kurnal
The die shots do not reveal new product details beyond what Intel has already outlined for Panther Lake, but they do provide a rare visual look at the chip’s internal structure. For Intel, the future is clearly oriented in tiles/chiplets. We will keep a close eye on the GPU tiles obviously.
You can obviously find higher-resolution images at Kurnal’s website.
Source: Kurnal via HotHardware
