IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1 nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High-NA EUV lithography processes to advance IBM's logic scaling roadmap.

IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7 nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1 nm node. The work will focus on developing new materials, advanced etch and deposition capabilities for increasingly complex device architectures, and new High-NA EUV lithography processes to enable next-generation interconnect and device patterning and accelerate industry adoption.