AMD, a leader in high-performance and AI computing, and Celestica Inc., a global leader in data center infrastructure and advanced technology solutions, today announced a strategic collaboration to bring the new "Helios" rack-scale AI platform to market. The collaboration pairs AMD computing leadership with Celestica's expertise in delivering leading-edge networking switch technologies. At launch, Celestica will undertake the R&D, design and manufacturing of scale-up networking switches in the AMD "Helios" rack-scale AI architecture, based on the Open Compute Project (OCP), Open-Rack-Wide (ORW) form-factor.

The scale-up switches will utilize advanced networking silicon to enable the high-speed interconnect of the next-generation AMD Instinct MI450 Series GPUs, enabling leading-edge computing, optimized for large-scale AI clusters. Consistent with the open standards-based design of the "Helios" platform, the networking switches will utilize the Ultra Accelerator Link over Ethernet (UALoE) architecture for scale-up connectivity. AMD "Helios" will be available to customers in late 2026.