Intel Nova Lake-S leak confirms DDR5-8000, NPU6 and 175W desktop SKUs
Recently we got a chance to look at updated Nova Lake-S roadmaps. You have already seen some details from this roadmap leak to the interwebs, but we thought you may actually want to see the full SKU list as it is now communicated by Intel to its partners.

Confirmed as Core Ultra 400 with future compatibility
First things first, Intel has now confirmed the Nova Lake-S series is indeed called “ Series 4 “, which means we can now confirm it will be part of the Core Ultra 400 series .
The material lists Coyote Cove P-cores, Arctic Wolf E-cores, Intel NPU 6, and DDR5 memory support of up to 8000 MT/s. It also points to Socket V cooling solution reuse and forward socket compatibility (this is specifically mentioned as a feature), which suggests Intel plans to keep at least part of the existing cooler ecosystem in place for the next desktop generation. This is great news because Intel is already confirming multi-gen support for the new socket. Not really surprising, but I do not recall roadmaps mentioning this as a feature.
Other upgrades
The platform list also confirms that Nova Lake-S is not just about CPU core counts. Intel is said to be preparing support for integrated Wi-Fi 7, Low Energy Audio, Wi-Fi based sensing, ECC, CUDIMM and CSODIMM memory, plus up to four independent displays. The same material mentions discrete graphics over x16 PCIe 5.0, CPU bifurcation in a 4×4 configuration, up to three x4 PCIe 5.0 links from the chipset, support for as many as eight SSDs across PCIe 5.0 and 4.0, and two Thunderbolt 5 connections.
Five package/die variants
Intel also appears to have five desktop die packages planned. These range from an 8-core design with 4P+0E cores, to 16-core and 28-core variants, and then two dual-die packages including a top 52-core configuration. All listed desktop packages are said to feature 4 LP E-cores, NPU 6, dual-channel DDR memory support, 24 PCIe Gen5 lanes, two Thunderbolt 5 ports , and two Xe3 GPU cores. In other words, all desktop SKUs appear to ship with the same small Xe3 graphics block.
| Nova Lake-S Desktop Dies | ||||||||
|---|---|---|---|---|---|---|---|---|
| VideoCardz | Die Type | CPU Configuration | Hub / LP E-Cores | NPU | Memory | PCIe | Thunderbolt | GPU |
| 8C | Single Die | 4P+0E | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 | 2 Xe3 cores GPU |
| 16C | Single Die | 4P+8E | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 | 2 Xe3 cores GPU |
| 28C | Single Die | 8P+16E | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 | 2 Xe3 cores GPU |
| 28C | DS | 8P+16E + cache | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 | 2 Xe3 cores GPU |
| 52C | DS | 8P+16E + cache & 8P+16E + cache | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 | 2 Xe3 cores GPU |
Currently 13 SKUs planned, two dual-compute tile variants
The preliminary SKU list adds the first look at product segmentation. It points to 35W, 65W, 125W and 175W parts, including two 175W top models with 52-core and 44-core configurations. These are the rumored Core X variants, spiritual successors to the HEDT series. As you can see, Intel has not put a pin on the name yet, but we think the X-branding would be logical here and match that of the mobile series.
Lower down the stack are Core Ultra 9, Core Ultra 7, Core Ultra 5 and Core Ultra 3 variants, with several entries carrying configurable TDP values down to 35W. The list also shows at least one GT0 variant, the MS2KF, which indicates Intel is preparing a graphics-disabled F-series style desktop SKU for Nova Lake-S.
Intel is now planning mass production of Nova Lake in the fourth quarter, we will have a more detailed post on this subject later.
| Intel Nova Lake-S Preliminary SKU List | |||||
|---|---|---|---|---|---|
| VideoCardz.com | Total Cores | Core Config P+E+LP | Code | Notes | TDP/cTDP |
| Brand TBD | 52C | (8+16)+(8+16)+4 | P3DX | Dual 8+16 CDIE DS Die Package | 175W |
| Brand TBD | 44C | (8+12)+(8+12)+4 | P2DX | Dual 8+16 CDIE DS Die Package | 175W |
| Core Ultra 9 | 28C | 8+16+4 | P2D | 8+16 CDIE DS Die Package | 125W |
| Core Ultra 9 | 28C | 8+16+4 | P2K | 8+16 CDIE Die Package | 125W/65W |
| Core Ultra 9 | 22C | 6+12+4 | P2 | 8+16 CDIE DS Die Package | 65W |
| Core Ultra 7 | 24C | 8+12+4 | P1D | 8+16 CDIE DS Die Package | 125W |
| Core Ultra 7 | 24C | 8+12+4 | P1K | 8+16 CDIE Die Package | 125W/65W |
| Core Ultra 7 | 16C | 4+8+4 | P1 | 4+8 CDIE Die Package | 65W/35W |
| Core Ultra 5 | 22C | 6+12+4 | MS2K / MS2KF | 8+16 CDIE Die Package, has GT0 variant (F SKU) | 125W/65W |
| Core Ultra 5 | 12C | 4+4+4 | MS2 | 4+8 CDIE Die Package | 65W/35W |
| Core Ultra 5 | 8C | 4+0+4 | MS1 | 4+0 CDIE Die Package | 65W/35W |
| Core Ultra 3 | 6C | 2+0+4 | T1 | 4+0 CDIE Die Package | 65W/35W |
Source: Intel