Somebody has tested 9950X3D2 with air cooling

AMD Ryzen 9 9950X3D2 has appeared in early HWBOT benchmark submissions ahead of launch. HWBOT already lists a processor page for the chip, which is AMD’s first dual 3D V-Cache SKU for consumers. The CPU is not available yet, and it is officially launching on April 22nd.

The screenshots show four benchmark results from the same system. Cinebench 2026 CPU Multi Thread scored 9,246 points and single-core score of 746 points. Cinebench R23 Multi Core scored 38,579 points. The 7-Zip benchmark result reached 227,919 MIPS.

Source: HWBOT

The setup appears to use an ASUS ROG STRIX B850-A GAMING WIFI motherboard, 32GB of DDR5-6000 memory from Kingston, a Radeon RX 7900 XTX, and Windows 11 25H2. CPU-Z also shows a 200W TDP, which lines up with AMD’s published specifications for the chip.

Source: HWBOT

Air cooling performance

The benchmark overlays also show clocks a little above 5.19 GHz during Cinebench runs. Logged package power reached 216W in Cinebench 2026 and 220W in Cinebench R23, while peak temperature hit 95 to 96°C in the posted screenshots. Those figures should be treated carefully because early submissions do not reveal the full test setup, BIOS tuning, cooling, or any motherboard-level power presets.

Even so, the entry is another sign that AMD’s new flagship is already in testers’ hands before launch. We can use this data for further comparisons, should they also leak.

Source: HWBOT

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