SK hynix enters SOCAMM2 volume phase with 192GB LPDDR5X module
SK hynix has announced mass production of its 192GB SOCAMM2 memory module, moving the LPDDR5X-based server format into a new phase as vendors prepare for next-generation AI systems. The company said the module is built on its 1c LPDDR5X process and is designed for NVIDIA’s Vera Rubin platform.
According to SK hynix, the 192GB SOCAMM2 delivers more than double the bandwidth and over 75% better power efficiency than conventional RDIMM memory. The format uses a detachable compression-style connector, which lets vendors keep LPDDR-class power use while still using a serviceable module design in AI servers.
Source: SK hynix
Samsung and Micron already at play
The announcement places SK hynix against Micron and Samsung in the same segment. Micron said in March that it had started shipping 256GB SOCAMM2 customer samples, built on its 1-gamma LPDDR5X process. That gives Micron the highest announced SOCAMM2 capacity so far, at least from publicly disclosed products.
Source: Trendforce
Samsung entered the discussion earlier. In December, Samsung said customer samples of its SOCAMM2 were already being supplied. Samsung’s current product page says SOCAMM2 can deliver more than 70% better power efficiency and up to 2.6x higher bandwidth than DDR-based server memory.
Right now, Micron appears to lead on announced capacity with 256GB samples, while SK hynix has become the latest company to confirm 192GB mass production tied directly to Vera Rubin. Now, if only there was any memory left for consumers, that would be wonderful.
Source: SK Hynix
