JEDEC expands LPDDR6 roadmap beyond mobile with SOCAMM2 and PIM
JEDEC has outlined the next step for LPDDR6, and this time the focus goes beyond phones and laptops. The standards body said the next update to JESD209-6 is being prepared to extend LPDDR6 into selected data center and accelerated computing workloads, building on the original LPDDR6 standard published in July 2025.
The planned update adds narrower per-die interface options, including x12 and a new x6 sub-channel mode, which JEDEC says should allow more dies per package and higher memory capacity per component and per channel. JEDEC is also adding a flexible metadata carve-out, aimed at letting customers trade off usable capacity and metadata allocation without a large hit to peak throughput.
JEDEC said 512 GB density is part of the LPDDR6 roadmap, while two related standards are also in development: LPDDR6 SOCAMM2 for compact, serviceable memory modules, and LPDDR6 PIM, which puts processing capability closer to the memory array to cut data movement and improve inference efficiency in edge and data center systems.
Planned features for the upcoming LPDDR6 update include:
- Narrower per-die interface (x6) enables higher capacities: With the move to a non-binary interface width – from x16 to x24, the inclusion of x12 and an additional x6 sub-channel mode, allows more die per package and higher memory capacities per component and per channel, a critical enabler for AI-scale memory footprints.
- Flexible metadata carve‑out intended to minimize impact to peak data throughput , giving data center customers the option to balance user capacity and metadata needs according to their specific reliability requirements.
- 512 GB density on the horizon : LPDDR6 is expected to unlock densities beyond the current LPDDR5/5X maximum, a capability designed to address the ever-growing memory capacity requirements of AI training and inference workloads.
- LPDDR6 SOCAMM2 module standard in development : JEDEC is actively working on an LPDDR6-based SOCAMM2 module standard, which is being designed to carry the compact, serviceable module form factor forward and offer a clear upgrade path from today’s LPDDR5X SOCAMM2 modules.
LPPDR6 status
Samsung used CES 2026 to present LPDDR6 as a next-generation part for mobile, AI PCs, data centers and automotive systems, and said it is also developing LPDDR6-based SOCAMM and LPDDR6-PIM. Micron said in December 2025 that it had begun sampling its 1-gamma 16Gb LPDDR6 product to OEM and ecosystem partners. SK hynix then announced in March 2026 that it had developed 1c LPDDR6 and was aiming for shipments in the second half of this year.
JEDEC did not provide a publication date for the updated LPDDR6 standard, LPDDR6 PIM, or LPDDR6 SOCAMM2. The group also noted that features can still change before final publication and board approval.
Source: JEDEC PR
