Rambus SOCAMM2 chipset adds SPD Hub and VRs for LPDDR5X server modules
Rambus has announced a SOCAMM2 server module chipset designed for LPDDR5X-based memory modules in AI platforms. The company says the new chipset supports JEDEC-standard SOCAMM2 modules running at up to 9.6 Gb/s, and marks the first product in a broader LPDDR-based server module roadmap.
This is not a new memory module from Rambus. It is the module-side support silicon meant to make those modules work in server designs. The chipset includes an SPD Hub for module identification, configuration and telemetry, plus 12A and 3A voltage regulators for local power conversion. Rambus also says the SPD Hub integrates a temperature sensor and communicates over I3C.
| RAMBUS Chipsets | ||
|---|---|---|
| Description | Part Number | Applications |
| 12 Amp Voltage Regulator | P2815Gxx | Server SOCAMM2 |
| 3 Amp Voltage Regulator | P2813Gxx | Server SOCAMM2 |
| SPD Hub with Internal Temperature Sensor | SPD1605Gxx | Server SOCAMM2, RDIMM, MRDIMM |
SOCAMM2 moves LPDDR into a detachable server module, instead of keeping it soldered to the board. That gives server platforms a way to keep LPDDR’s lower power profile while improving serviceability, upgradeability, and board space use in AI systems.
Micron is already shipping SOCAMM2 products, including a 256GB module, while AMD recently said its 6th Gen EPYC “Verano” family, due in 2027, will include SKUs with LPDDR5X SOCAMM2 support. Rambus is effectively filling in the chipset layer around that emerging ecosystem.
Source: RAMBUS PR
