Samsung, SK hynix and Micron move ahead with DDR6 plans
Samsung, SK hynix and Micron have reportedly started early development work for DDR6 substrates. According to TheElec, the memory makers have already asked substrate suppliers to prepare designs even though the JEDEC standard is not final yet.
The report says suppliers are working with partial design data. This includes early information on memory thickness, substrate structure and routing. The goal is to prepare test samples before DDR6 moves closer to mass production.
“Memory companies and substrate manufacturers typically proceed with joint development more than two years before product launch,” said an official from the substrate industry. “Initial development of DDR6 has recently begun.”
THE ELEC (translation)
DDR6 is expected to bring a large speed increase over DDR5. Earlier JEDEC roadmap information pointed to DDR6 speeds up to 17.6 Gbps , roughly twice the upper range planned for DDR5. Commercial DDR6 memory is currently expected around 2028 to 2029.
While we are talking about DDR6 already, the price question will be harder to answer. DDR5 arrived with a large price increase for new consumer platforms (we all remember Alder Lake), but it later became affordable. Now DDR5 prices are rising again as AI demand puts pressure on memory supply. Will DDR6 end up any better? We will see.
Source: The Elec
