AMD Zen 7 “Grimlock” may use Powertech FOPLP packaging
Commercial Times claims AMD is preparing next-generation CCDs may use TSMC A14.

AMD has reportedly started early supply chain work for Zen 7, its next CPU architecture after Zen 6. According to Commercial Times, the next-generation Core Complex Die is codenamed “ Grimlock ” and is expected to use TSMC’s A14 process node.
A14 is TSMC’s 1.4nm-class process. TSMC says the node is on track for volume production in 2028. The reported Zen 7 schedule would therefore align with TSMC’s Fab 25 P1 facility in Taichung, which is expected to start pilot production in 2027 before mass production in 2028.
FOPLP for Zen7
Commercial Times also claims AMD is evaluating Powertech Technology’s FOPLP packaging. FOPLP stands for fan-out panel-level packaging. This approach is being considered as AMD prepares larger and more complex chiplet packages for future CPUs.
AMD has begun its supply chain preparations for its next-generation Zen 7 platform ahead of schedule. Supply chain sources reveal that the Zen 7 core chipset (CCD), codenamed Grimlock, will utilize TSMC’s A14 process and incorporate next-generation 3D V-Cache technology. The company is also evaluating Powertech’s FOPLP (Fan-Out Panel-Level Packaging) solution.
Commercial Times
Zen7 rumors
The report also mentions next-generation 3D V-Cache. The Zen 7 CCD is said to feature up to 16 cores, while 3D V-Cache variants could reportedly reach up to 224MB of L3 cache per CCD.
AMD has not confirmed Zen 7 specifications, the Grimlock codename, the A14 node, or the 2028 launch window. The company has only recently confirmed that EPYC “Venice,” based on Zen 6, has entered production ramp on TSMC’s 2nm process. We covered last year that Venice had already taped out on TSMC N2, with AMD confirming it as its sixth-generation EPYC platform.
Zen Roadmap, Source: AMD
Zen 7 is still at least one full CPU generation away. For now, the only confirmed part of the roadmap is Venice on Zen 6 and TSMC N2.
| AMD architecture | ||
|---|---|---|
| VideoCardz.com | Node | Main use |
| Zen | GlobalFoundries 14LPP | Ryzen 1000, EPYC 7001 |
| Zen+ | GlobalFoundries 12LP | Ryzen 2000 |
| Zen 2 | TSMC N7 | Ryzen 3000, EPYC 7002 |
| Zen 3 | TSMC N7 | Ryzen 5000, EPYC 7003 |
| Zen 3+ | TSMC N6 | Ryzen 6000 |
| Zen 4 | TSMC N5 | Ryzen 7000, EPYC 9004 |
| Zen 4 (mobile) | TSMC N4 | Ryzen 7040/8040 APUs |
| Zen 4c | TSMC N5 | EPYC Bergamo/Siena |
| Zen 5 | TSMC N4 family | Ryzen 9000, EPYC 9005 Zen 5 |
| Zen 5 (mobile) | TSMC N4P | Ryzen AI 300, Ryzen AI 400 |
| Zen 5c | TSMC N3 family | EPYC 9005 |
| Zen 6 🆕 | TSMC N2 | Ryzen 10000, Ryzen AI 500, EPYC 9006 |
| Zen 7🆕 | reportedly TSMC A14 | “Grimlock” |
Source: Commercial Times , Wccftech