Apacer adds 0.17 mm copper and graphene cooling layer to industrial DDR5
Apacer has announced GraTherX, a new thermal solution for DDR5 memory modules. The company says the design can reduce module temperatures by up to 23.4°C under high-load conditions.
This is not a standard gaming memory heat spreader. GraTherX is aimed at industrial DDR5 modules used in fanless systems, edge AI hardware, smart surveillance, in-vehicle computers and other space-limited platforms.
Grapehne and copper that wraps around memory module
According to Apacer, DDR5 modules with GraTherX were tested under natural convection. The module temperature dropped from 82.7°C to 59.3°C. The company also claims the temperature difference between the front and back side of the module was reduced to below 0.8°C.
Source: Apacer
GraTherX uses a multilayer design with copper and graphene materials. The structure moves heat from rear-side components to the front side of the module, where it can be dissipated more easily. Apacer says the layer is around 0.17 mm thick per side, so it can be added to existing DDR5 platforms without motherboard redesigns.
Source: Apacer
The company also claims a 2.7x MTBF (mean time between failures) improvement based on reliability modeling. As usual with such figures, the final result will depend on system airflow, module configuration and workload.
Apacer plans to use GraTherX across its industrial DDR5 portfolio, including ECC and non-ECC modules. Samples are planned for the second quarter, with mass production to follow. There’s no word on pricing or retail availbilty for DIY market.
Source: Apacer , TechPowerUP
