Silicon photonics has emerged as a promising technology for addressing bandwidth and latency bottlenecks of conventional electrical interconnects and therefore are being explored for future artificial intelligence infrastructure. However, heterogenous integration of multiple material systems remains a challenge. Now, researchers show how micro-transfer printing can enable highly versatile heterogenous integration to expand the functionality of silicon photonics, paving the way for advanced photonic systems.

The rapid growth of artificial intelligence and related computing infrastructure has exposed the limited bandwidth of conventional electrical interconnects in integrated circuits as a major bottleneck to system performance. Silicon photonics, which transmits data using photons instead of electrons, has emerged as a promising approach for overcoming bandwidth and latency limitations. The platform is now widely used for photonic integrated circuits (PICs), particularly in telecom and datacom applications.