TSMC has reportedly reached a new milestone in scaling its 2 nm node high-volume manufacturing, now producing 20,000 wafers per month on the N2 node alone. Manufactured across five fabs in Taiwan, the company currently has only one fab in volume production on the N2 node. This is reportedly Fab 20, which has reached this figure. TSMC began high-volume production of its N2 node in the fourth quarter of 2025. Fast-forward two quarters to today, and the 2 nm node now accounts for only 3% of the company's revenue, while the 3 nm node commands 30%, and the 5 nm node holds the top spot at 33%.

Recently, the company confirmed that the N2 node has four times the number of tape-outs compared to its previous leading-edge 3 nm N3 node. With GAAFET technology, TSMC's N2 delivers up to a 15% performance increase at the same power level or up to a 30% power reduction at the same speed. This has driven four times the number of customers doing tape-outs, including AMD with its EPYC "Venice" server CPUs, Apple with its A20 Pro chips for the iPhone 18 Pro series, and many others. Even though the N2 ramp now accounts for a small portion of revenue and wafer output, the majority of the business is gradually heading in that direction.