Intel's upcoming "Nova Lake-S" is gearing up for a launch later this year. However, rumors suggest that certain "Nova Lake-S" models with large integrated graphics might require significant power, increasing the TDP and peak power. According to the well-known Intel leaker Jaykihn on X, Intel's 16-core CPU SKU with 12 Xe3P cores will need specialized power delivery, with 65 W dedicated to integrated graphics. This SKU includes four P-Cores, eight E-Cores, and four LPE-Cores, along with 12 Xe3P GPU cores. This 4+8+8+12 core configuration is one of the few processors where integrated graphics require two VCCGT phases. In regular SKUs, VCCGT is a single-phase power rail for the integrated graphics inside the processor. However, since Intel aims to enhance its iGPU performance with "Nova Lake," a single phase is insufficient.

Previously, we learned that Intel's top-end, overclocking-focused, dual compute die "Nova Lake-S" CPU with 52 cores will feature a PL2 mode with a power level of 474 W. This also includes the possibility of three 8-pin CPU power connectors on high-end Z990 motherboards, an intriguing design choice considering that most enthusiast boards typically have two 8-pin EPS CPU connectors. The three 8-pin connectors are mainly intended for the highest-end overclocking designs, rather than being necessary for running the dual compute die designs. Motherboards with either two or three EPS connectors are still expected to support Intel's upcoming high-end 44-core and 52-core processors on the 175 W platform. However, we are likely to see various configurations, and motherboard designs are preparing for higher TDPs. Below image is illustration only.