TSMC is reportedly planning a stopgap between its 5 nm-class silicon fabrication nodes, and the 3 nm-class, called N4. According to the foundry's CEO, Liu Deyin, speaking at a shareholders meeting, N4 will be a 4 nm node, and an enhancement of N5P, the company's most advanced 5 nm-class node. N4 is slated for mass-production of contracted products in 2023, and could help TSMC's customers execute their product roadmaps of the time. From the looks of it, N4 is a repeat of the N6 story: a nodelet that's an enhancement of N7+, the company's most advanced 7 nm-class node that leverages EUV lithography.