AMD on Thursday unveiled its Ryzen 6000 series "Rembrandt" mobile processors. The company claims these chips offer generational increases in CPU performance, along with big leaps in energy-efficiency and integrated graphics performance. At the heart of these processors is the new 6 nm "Rembrandt" silicon that the company is building on the TSMC N6 silicon fabrication node that leverages EUV lithography.

The "Rembrandt" silicon broadly combines an 8-core/16-thread CPU based on the new Zen 3+ microarchitecture, a large new iGPU based on the RDNA2 graphics architecture, complete with real-time ray tracing support; a DDR5 + LPDDR5 memory controller, and a full PCI-Express Gen4 root-complex. The iGPU, memory interface, and PCIe interface are generational updates over the previous-gen "Cezanne," and it may seem like the CPU is largely unchanged, but AMD claims there are several optimizations that have gone into the CPU to earn the "+" tag.