ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE). The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

Leveraging innovative ASUS thermal design, ASUS rack server solutions empower enhanced system airflow—minimizing power consumption and maximizing efficiency. The lower power consumption aligns with the ASUS 2025 Sustainability Goals initiative, which aims to bring about proactive and positive change. The new hard-drive tray design on the front panel of the RS series servers features ventilation holes that are 44% wider compared to the previous generation, increasing airflow through the system and improving thermal efficiency. This adds to component longevity, including the latest DDR5, PCIe 5.0 and NVMe technologies. The improved fan-tunnel design, with independent CPU- and GPU-airflow tunnels, increases the capabilities of 400 W CPUs and 350 W GPUs—significantly boosting compute-intensive enterprise workloads.